Ultrathin Laser Welding Electronic Component Electrode

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Solution Overview

Problem

Conventional techniques for bonding electrode films and leads in electronic components on ultrathin insulating substrates fail to adequately address thermal responsiveness, size reduction, tensile strength, and heat resistance, often causing thermal damage to the substrate and requiring complex processes for high-density mounting.

Innovation Solution

An electronic component configuration featuring a high melting point active layer, a barrier layer, and a low melting point bonding layer, with a bonding electrode part thickness of 1 μm or less, allowing for efficient tensile strength and heat resistance improvements without substrate damage, and enabling high-density, reliable mounting through laser welding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If soldering is used for bonding leads to electrode films, then bonding is achieved, but operating temperature is limited to 150°C or less and thickness cannot be reduced

Engineering Contradiction:

Improveoperating temperatureVSAvoidthickness of bonding part

Core Design Contradiction:

TemperatureVSLength of moving object

Solution Approach 1:

The patent changes the bonding method from soldering to laser welding, fundamentally altering the bonding parameters. Laser welding enables operation at temperatures exceeding 150°C and achieves bonding thickness of 1 μm or less, simultaneously resolving both the temperature limitation and thickness reduction requirements.

Inventive Principle:

Principle #35Parameter changes

2Strength

If conductive paste is used for bonding, then bonding is achieved, but tensile strength is insufficient and glass sealing reinforcement is required

Engineering Contradiction:

Improvetensile strengthVSAvoidcomplexity of bonding structure

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical bonding method (conductive paste with glass sealing) with laser welding. This substitution achieves high tensile strength through direct metal-to-metal bonding without requiring additional glass sealing reinforcement, thereby reducing structural complexity while improving strength.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If plating layer or bump layer is added for laser welding, then heat resistance is improved, but size and thickness increase

Engineering Contradiction:

Improveheat resistanceVSAvoidsize of bonding part

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent employs an ultrathin insulating substrate with thickness of 100 μm or less as the bonding electrode part. This thin film structure achieves high heat resistance through laser welding while maintaining minimal size and thickness, eliminating the need for bulky plating layers or bump structures.

Inventive Principle:

Principle #30Flexible shells and thin films

4Speed

If ultrathin insulating substrate is used, then thermal responsiveness is improved, but tensile strength and heat resistance are compromised

Engineering Contradiction:

Improvethermal responsivenessVSAvoidtensile strength and heat resistance

Core Design Contradiction:

SpeedVSReliability

Solution Approach 1:

The patent utilizes laser welding parameters to achieve high-energy-density bonding that penetrates through the ultrathin insulating substrate. This parameter change enables the thin substrate (100 μm or less) to maintain both high thermal responsiveness and sufficient tensile strength and heat resistance through precise control of the bonding process.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal responsiveness, tensile strength, and reliability by reducing the bonding electrode part thickness, eliminating the need for glass reinforcement, and allowing for high heat resistance and simplified assembly processes.

Implementation Method 1

a welding part of the bonding layer is melted by irradiation of a laser beam, so that the lead and the bonding electrode part are bonded to each other

Methodology Applied

Scientific EffectLaser beam irradiation heating: Laser

Implementation Method 2

the lead and the bonding electrode part are diffusion-bonded

Methodology Applied

Scientific EffectDiffusion bonding: Diffusion Welding

Data Source

PatentUS11215514B2Electronic component for welding, mounted board and temperature sensor

Publication Date: 2022.01.04 SEMITEC

AI summary

The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.