Laser-Formed Wick Cooling Structure for Heating Elements
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Solution Overview
Problem
The productivity and cost efficiency of heat pipe or vapor chamber type cooling devices are hindered by limitations in the sintering process and complex production processes, including brazing, which complicate the manufacturing of capillary wick units and increase costs.
Innovation Solution
A method and structure that utilize a laser to form and bond capillary wick units within a heating element cooling system, simplifying the manufacturing process by using press molds for upper and lower plates and laser bonding, thereby improving productivity and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a sintering method is used to manufacture the capillary wick unit, then the capillary structure is formed, but the productivity is reduced due to limitations in the sintering process and conditions
Solution Approach 1:
The patent replaces the traditional sintering process (thermal/chemical system) with a laser-based manufacturing system. The laser directly forms the capillary wick unit structure through controlled material removal or deposition, eliminating the need for sintering and enabling faster, more flexible manufacturing without compromising capillary structure quality
Solution Approach 2:
The patent changes the manufacturing parameters from sintering temperature, pressure, and time conditions to laser parameters such as power, scanning speed, and focal position. This parameter transformation enables precise control of the capillary structure formation while dramatically reducing processing time and improving productivity
2Reliability
If various configurations such as capillary structures and pillar structures are bonded using brazing, then the cooling device is assembled, but the production process is complicated and costs increase
Solution Approach 1:
The patent merges multiple separate bonding operations (capillary structure bonding, pillar structure bonding, plate assembly) into a single integrated laser bonding process. The laser system can sequentially or simultaneously bond different components with the same upper plate, eliminating the need for multiple brazing operations and simplifying the overall production process
Solution Approach 2:
The patent replaces the brazing process (which requires flux, controlled atmosphere, and post-processing) with direct laser bonding. This substitution eliminates the complexity of brazing chemistry and process control while maintaining strong, reliable bonds between the heat conductive plate, capillary structures, and pillar structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances productivity and reduces costs by simplifying the manufacturing process and improving the formation of capillary wick units, leading to more efficient cooling of heating elements in electronic devices.
Implementation Method 1
forming a wick unit at one or more of an inner surface of the upper plate and an inner surface of the lower plate by using a laser
Implementation Method 2
bonding the upper plate and the lower plate to each other
Data Source
AI summary
According to at least one aspect, the present disclosure provides A method for manufacturing a heating element cooling structure, the method comprising: manufacturing an upper plate, which includes a plurality of column units, by using a press mold method; manufacturing a lower plate by using the press mold method; forming a wick unit at one or more of an inner surface of the upper plate and an inner surface of the lower plate by using a laser; and bonding the upper plate and the lower plate to each other.