Laser Wire Processing Device with Centering Guide
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Solution Overview
Problem
Conductive wires with insulation layers exhibit a 'memory' effect, causing curvature issues that make it difficult to center the wire correctly within laser wire-processing devices, leading to incomplete or accidental cutting of the insulation layer.
Innovation Solution
A laser wire-processing device with a wire guide, such as a tube and backstop, that aligns and straightens the wire, combined with a centering member and clamps to ensure precise positioning and cutting of the insulation layer around the wire's periphery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wire is inserted through the aperture without guidance, then insertion is simple and quick, but the wire cannot be centered properly relative to the cutting laser
Solution Approach 1:
A wire guide is introduced as an intermediary component between the aperture and the cutting laser. The wire guide receives the wire at the aperture and directs it along a guided path to the cutting position, ensuring proper centering without complicating the insertion process. The wire guide acts as a mediator that transforms the simple insertion action into a precisely positioned wire for cutting.
Solution Approach 2:
The patent replaces complex mechanical centering mechanisms with a simpler wire guide structure that uses the wire's own insertion motion to achieve centering. Instead of requiring additional actuators, sensors, or adjustment mechanisms, the wire guide utilizes the natural insertion path to guide the wire to the correct position relative to the cutting laser.
2Device complexity
If wire is inserted without a wire guide, then the device structure is simple, but the insulation layer is not cut completely or is cut inadvertently
Solution Approach 1:
The wire guide serves as an intermediary structure that ensures reliable positioning of the wire before cutting. By introducing this intermediate guiding element, the patent achieves complete and accurate insulation layer cutting without significantly increasing overall device complexity. The wire guide mediates between the simple aperture entry and the precise cutting requirement.
Solution Approach 2:
The wire guide performs preliminary positioning and centering of the wire before the cutting operation begins. This preliminary action ensures that the wire is properly aligned and positioned relative to the cutting laser, preventing incomplete or accidental cutting. The wire guide prepares the wire in advance for the cutting operation, ensuring reliability before the actual cutting occurs.
3Ease of operation
If wire with curvature is inserted directly, then insertion is straightforward, but the wire end is off center relative to the cutting laser
Solution Approach 1:
The wire guide acts as an intermediary that accepts wires with various curvatures at the aperture and guides them to a standardized, centered position at the cutting location. The wire guide transforms the variable, curved wire paths into a consistent, centered position, maintaining ease of insertion while achieving precise positioning for accurate cutting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively aligns and cuts the insulation layer completely, preventing damage to the electrical conductor and ensuring accurate wire processing.
Implementation Method 1
operating a laser in the laser wire-processing device to cut the insulation layer around a periphery of the wire
Data Source
AI summary
A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.