Semiconductor Laser Wire Layout for Uniform Current and Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor laser elements with multiple wires face issues of uneven current distribution and heat concentration due to improper wire arrangement, leading to reduced output power and heat dissipation efficiency.
Innovation Solution
The semiconductor laser device employs a substrate with marked regions and wire groups, allowing precise placement of wires to ensure even current distribution and improved heat dissipation by using mark portions on the substrate to guide wire positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If multiple wires are used to supply current, then electrical resistance is reduced, but wire arrangement precision deteriorates
Solution Approach 1:
Mark portions are formed on the substrate beforehand at predetermined positions where wires should be bonded. These marks serve as guides during the wire bonding process, ensuring that wires are placed at correct positions without requiring complex alignment procedures. This preliminary marking action resolves the contradiction by providing simple visual cues that maintain manufacturing precision while allowing the use of multiple wires.
2Ease of manufacture
If wires are unevenly arranged, then manufacturing is easier, but current distribution uniformity deteriorates
Solution Approach 1:
The substrate is pre-marked with portions indicating exact wire placement positions. During manufacturing, workers simply follow these marks to place wires, making the process easy while ensuring uniform current distribution through proper positioning. The marks encode the optimal arrangement pattern that balances ease of manufacture with current distribution requirements.
3Ease of manufacture
If wires are concentrated in one area, then bonding is simpler, but heat dissipation efficiency deteriorates
Solution Approach 1:
Mark portions are strategically positioned on the substrate to guide wire placement in a distributed pattern rather than concentrated in one area. This preliminary marking ensures that wires are placed at optimal locations for both bonding simplicity and heat dissipation, resolving the contradiction by encoding the ideal spatial distribution in the substrate marks.
Data Source
AI summary
A semiconductor laser device includes a substrate including a main surface, a semiconductor laser element including a resonator extending along a first direction, and a plurality of first wire groups and a plurality of second wire groups arranged along the first direction. Each first wire group includes a first wire bonded to a first bonding region of a top surface of the semiconductor laser element and a first mark portion, and a first mark portion formed on the main surface. Each second wire group includes a second wire bonded to a second bonding region of the main surface, and a second mark portion formed on the main surface. In a top view of the main surface, the first wire is disposed at a position overlapping the first mark portion, and the second wire is disposed at a position overlapping the second mark portion.