Modular Laser Processing Worktable for Dummy Portion Reduction

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Solution Overview

Problem

Existing worktables for laser processing face challenges in minimizing the dummy portion of substrates during cutting, which results in material waste and increased processing costs.

Innovation Solution

The worktable design includes a lower plate with specific areas and blocks that allow for the definition of cutting lines and the minimization of the dummy portion by adjusting the shape and arrangement of internal and external blocks, which can be easily replaced to accommodate different cutting shapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the worktable is replaced to accommodate new cutting line shapes, then the adaptability to different cutting shapes is improved, but the device complexity and cost increase

Engineering Contradiction:
Improveadaptability to different cutting shapesVSAvoidworktable replacement complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The worktable is segmented into a base plate and multiple interchangeable block components (first blocks, second blocks, third blocks). These blocks can be selectively arranged and combined to form different worktable configurations suitable for various cutting line shapes, eliminating the need to replace the entire worktable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The worktable configuration is made dynamic and adjustable through the interchangeable block system. Users can reconfigure the blocks according to different processing requirements, allowing the worktable to adapt to various cutting shapes without permanent modification or complete replacement.

Inventive Principle:
Principle #15Dynamics

2Loss of substance

If the dummy portion of substrate is minimized by adjusting cutting line shape, then material waste is reduced, but the worktable must be redesigned for each new shape

Engineering Contradiction:
Improvematerial wasteVSAvoidworktable redesign requirement
Core Design Contradiction:
Loss of substanceVSDevice complexity

Solution Approach 1:

The worktable is divided into modular blocks that can be selectively assembled. This segmentation allows the worktable structure to be reconfigured for different cutting shapes to minimize dummy portions, without requiring complete redesign or replacement of the worktable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The same set of interchangeable blocks can serve multiple functions for different cutting shapes and processing requirements. This multi-functionality allows a single worktable kit to handle various substrate shapes and cutting patterns, reducing material waste across different applications.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If the entire worktable is replaced to process different cutting shapes, then the manufacturing precision for new shapes is improved, but the loss of time and increased cost occur

Engineering Contradiction:
Improvecutting line precisionVSAvoidworktable replacement time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The worktable is segmented into reusable base components and interchangeable blocks. Only the necessary blocks need to be swapped for different cutting shapes, significantly reducing the time and effort compared to replacing the entire worktable while maintaining manufacturing precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple block configurations can be prepared in advance for different cutting shapes. When a shape change is needed, the pre-prepared blocks can be quickly installed, reducing setup time and allowing rapid transition between different processing requirements while maintaining precision.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12263543B2Worktable for laser processing
Publication Date: 2025.04.01 SAMSUNG DISPLAY CO LTD
  • US12263543B2 patent drawing
  • US12263543B2 patent drawing
  • US12263543B2 patent drawing

AI summary

A worktable for laser processing includes a lower plate, internal blocks, and external blocks. The lower plate includes a first area, a second area surrounding the first area, and a third area surrounding the second area. The internal blocks are disposed on the lower plate in the first area and the external blocks are disposed on the lower plate in the third area. The external blocks surround the internal blocks.