Laser Processing Work Table With Integrated Particle Suction

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Solution Overview

Problem

In laser processing, substrates and work tables become contaminated with fine particles and fumes, which are not effectively managed by existing technologies, leading to inefficiencies and contamination issues.

Innovation Solution

A work table design featuring an upper plate with cell regions and groove regions, including absorption holes for fixing substrates and suction holes for collecting particles, coupled with a lower plate forming absorption and suction paths, which utilize vacuum pressure and external devices to manage contamination during processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a conventional work table is used for laser processing, then the substrate can be processed, but the work table becomes contaminated with fine particles and fumes that are not effectively collected

Engineering Contradiction:
Improvecontamination of work tableVSAvoidprocess efficiency
Core Design Contradiction:
Object-affected harmful factorsVSProductivity

Solution Approach 1:

The work table surface is segmented into multiple cell regions separated by groove regions, with suction holes strategically positioned in the groove regions to collect particles at their generation points, preventing widespread contamination

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A suction system acts as an intermediary between the laser processing zone and the work table surface, capturing particles and fumes through suction holes and exhaust ports before they can contaminate the work table

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If vacuum pressure is applied to fix the substrate, then the substrate is securely held, but particles and fumes are generated during cutting that contaminate the work area

Engineering Contradiction:
Improvesubstrate fixationVSAvoidparticles and fumes
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The substrate fixation function and particle collection function are merged into a single work table structure, where the same vacuum system that secures the substrate also facilitates particle removal through integrated suction holes and exhaust pathways

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The vacuum pressure used to fix the substrate is converted into a beneficial force for particle removal, where the same pressure differential that holds the substrate in place also drives particles through suction holes to the exhaust system

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces contamination by collecting particles and fumes, improving process efficiency and allowing for prolonged cleaning cycles, thereby maintaining a low-contamination surface treatment.

Implementation Method 1

A plurality of absorption holes is disposed on the upper plate. The plurality of absorption holes is configured to fix a substrate to the upper plate with vacuum pressure

Methodology Applied
Scientific EffectVacuum pressure: Vacuum

Implementation Method 2

A plurality of suction holes is disposed on the upper plate. The plurality of suction holes is configured to collect particles generated during the cutting of the substrate

Methodology Applied
Scientific EffectSuction: Suction

Data Source

PatentUS11273523B2Work table for laser processing and method of operating the same
Publication Date: 2022.03.15 SAMSUNG DISPLAY CO LTD
  • US11273523B2 patent drawing
  • US11273523B2 patent drawing
  • US11273523B2 patent drawing

AI summary

A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.