Laser Processing Work Table With Suction Grooves for Particle Removal
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Solution Overview
Problem
In laser processing, substrates and work tables become contaminated with fine particles and fumes, which are not effectively managed by existing technologies, leading to inefficiencies and contamination issues.
Innovation Solution
A work table design featuring an upper plate with cell regions and groove regions, including absorption holes for vacuum fixation and suction holes for particle collection, coupled with a lower plate forming absorption and suction paths, which are connected to external devices for efficient particle and fume removal, along with a cleaning method using a blower for ionization and ultrasonic wave cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional work table is used for laser processing, then the substrate can be processed, but the work table and substrate become contaminated with fine particles and fumes
Solution Approach 1:
The work table surface is segmented into multiple cell regions separated by groove regions, with each cell region containing absorption holes for localized substrate fixation. This segmentation allows particles to be contained within specific cell regions and prevents widespread contamination across the entire work table surface.
Solution Approach 2:
A suction system with suction holes positioned in the groove regions acts as an intermediary between the laser processing zone and the work table surface. This intermediary structure actively removes particles and fumes generated during laser processing before they can contaminate the substrate and work table, thereby maintaining process efficiency and reducing harmful contamination factors.
2Object-affected harmful factors
If existing particle management technologies are used, then some particle removal is achieved, but contamination is not effectively managed
Solution Approach 1:
Different regions of the work table are assigned different functions: cell regions contain absorption holes for substrate fixation while groove regions contain suction holes for particle collection. This local differentiation optimizes each region's performance - the cell regions provide stable substrate holding while the groove regions efficiently capture particles and fumes at their source, thereby effectively managing contamination without compromising productivity.
Solution Approach 2:
The suction system operates continuously during laser processing, maintaining constant particle removal capability throughout the entire processing cycle. This continuous action ensures that particles and fumes are consistently managed from generation to removal, preventing accumulation and contamination while maintaining uninterrupted productivity.
3Ease of manufacture
If the work table surface is made smooth for easy cleaning, then cleaning is simplified, but particle collection efficiency is reduced
Solution Approach 1:
The groove regions that contain suction holes create a segmented surface structure. These grooves serve dual purposes: they provide pathways for particle suction while also creating defined boundaries that facilitate cleaning. The segmented structure allows cleaning solutions to flow efficiently through the grooves to reach all surfaces, maintaining ease of cleaning while the vertical walls of the grooves enhance particle collection by directing particles toward suction holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces contamination by collecting and removing particles and fumes during the laser cutting process, enhancing process efficiency and allowing for prolonged cleaning cycles.
Implementation Method 1
A plurality of absorption holes is disposed on the upper plate. The plurality of absorption holes is configured to fix a substrate to the upper plate with vacuum pressure
Implementation Method 2
A plurality of suction holes is disposed on the upper plate. The plurality of suction holes is configured to collect particles generated during the cutting of the substrate
Data Source
AI summary
A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.