Lateral Board-to-Board Connecting Structure for Thin PCBs
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Solution Overview
Problem
Existing methods for connecting circuit boards in electronic devices, such as anisotropic conductive film and pulse hot-press welding, often increase the thickness of the product, which is undesirable for improving performance and maintaining a thin, bendable form factor.
Innovation Solution
A board-to-board connecting structure is achieved by stacking and pressing together circuit substrates with conductive vias and adhesive layers, allowing for electrical connection without adding vertical thickness, using a method that includes etching copper foil layers, forming wiring layers, and inserting a second circuit board into a receiving space defined by the first circuit board, with conductive blocks and protective layers ensuring connectivity and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connection methods (ACF, hotbar, connectors) are used to connect circuit boards, then electrical connection between boards is achieved, but the thickness of the product increases
Solution Approach 1:
The invention transitions from vertical stacking (increasing thickness) to lateral integration (maintaining thickness). Circuit boards are connected side-by-side within the same plane using a shared support structure, eliminating the need for vertical stacking that increases product thickness while maintaining reliable electrical connections between boards.
Solution Approach 2:
The support structure serves multiple functions: it provides mechanical support for both circuit boards simultaneously and establishes electrical connections between them. This multi-functional design eliminates the need for separate connection components that would add to the overall thickness.
2Reliability
If circuit boards are stacked vertically to achieve connection, then electrical connectivity is established, but the device loses bendability and increases in thickness
Solution Approach 1:
The invention arranges circuit boards in a lateral configuration rather than vertical stacking, allowing the device to maintain its thin profile and bendability. The support structure enables side-by-side board placement that accommodates flexible device designs while ensuring reliable electrical connectivity between boards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables thin and bendable electronic devices by maintaining the original thickness of the circuit boards while ensuring reliable electrical connections, avoiding the thickness increase associated with traditional methods.
Implementation Method 1
etching copper foil layers, forming wiring layers
Implementation Method 2
copper electroplating on the second double-sided copper clad laminate
Implementation Method 3
stacking and pressing together circuit substrates with conductive vias and adhesive layers
Data Source
AI summary
A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.