Lateral Bonding of Semiconductor Die Sidewalls
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Solution Overview
Problem
Conventional wafer bonding or die bonding techniques primarily provide vertical connections between semiconductor dies, limiting the number and density of bonding locations, which restricts the integration and functionality of semiconductor devices.
Innovation Solution
The implementation of lateral bonding between bonding pads on semiconductor dies, allowing for increased bonding locations and density by bonding the sidewalls of one die to the sidewalls of another, enabling non-horizontal metal-to-metal connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional vertical bonding techniques are used, then the bonding process is simple, but the number and density of bonding locations are limited
Solution Approach 1:
The patent transitions from conventional vertical bonding to lateral bonding, utilizing the sidewalls of bonding pads in the horizontal plane. This dimensional change allows multiple bonding locations to be established simultaneously across the bonding interface, dramatically increasing the number of bonding locations without proportionally increasing process complexity
Solution Approach 2:
The bonding pads are segmented to expose their sidewalls, creating multiple discrete bonding surfaces. Each bonding pad's sidewall can be independently bonded to corresponding structures, enabling parallel bonding operations that increase the overall number of bonding locations while maintaining manageable process complexity
2Adaptability or versatility
If conventional vertical bonding techniques are used, then the bonding process is straightforward, but the integration and functionality of semiconductor devices are restricted
Solution Approach 1:
By moving from vertical to lateral bonding, the patent enables more flexible device configurations and higher integration density. The lateral bonding approach allows semiconductor devices to be arranged in more complex three-dimensional configurations, enhancing adaptability and functionality
Solution Approach 2:
The lateral bonding technique enables nested or stacked device configurations where bonding pads and interconnect structures can be arranged in overlapping or nested patterns. This increases the functional integration capability by allowing multiple devices or functional blocks to be combined in a compact footprint
3Quantity of substance
If lateral bonding of sidewalls is implemented, then the density of bonding locations increases, but the bonding process complexity increases
Solution Approach 1:
The sidewalls of bonding pads are prepared and exposed before the actual bonding operation. This preliminary action includes forming the bonding pads with appropriate geometry, removing protective layers from sidewalls, and positioning structures to ensure proper alignment. By preparing everything in advance, the actual lateral bonding process becomes more straightforward despite the increased number of bonding locations
Data Source
AI summary
A bonded assembly includes a first die containing first bonding pads having sidewalls that are laterally bonded to sidewalls of second bonding pads of a second die.