Lateral Bridge Interconnect Structure for Compact SiP Package Spacing

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Solution Overview

Problem

The challenge in the semiconductor industry is to reduce the distance between semiconductor packages to achieve smaller, faster, and higher-performance System-in-Package (SiP) systems.

Innovation Solution

An interconnect device comprising an insulating frame with multiple layers and bridge conductors is used to electrically connect two adjacent semiconductor packages, reducing the distance between them by connecting at their lateral surfaces rather than through additional interconnect devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If traditional interconnect devices are used to connect semiconductor packages, then reliable electrical connections are achieved, but the distance between semiconductor packages increases and the SiP system size increases

Engineering Contradiction:

Improvedistance between semiconductor packagesVSAvoidelectrical connection reliability

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent transitions from vertical stacking to lateral surface mounting, changing the spatial dimension of interconnection. Bridge conductors are disposed laterally between adjacent semiconductor packages rather than vertically through substrates, reducing the distance between packages while maintaining reliable electrical connections through direct lateral contact.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The interconnect device is segmented into multiple functional components: an insulating frame with top and bottom insulating layers, a central insulating layer with through-holes, and bridge conductors disposed within the through-holes. This segmentation allows each component to perform its specific function optimally while collectively achieving compact packaging with reduced distance between semiconductor packages.

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If the distance between semiconductor packages is reduced, then the SiP system size is reduced, but manufacturing complexity increases

Engineering Contradiction:

ImproveSiP system sizeVSAvoidinterconnect device structure

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The insulating frame serves multiple functions simultaneously: it provides mechanical support for the bridge conductors, provides electrical insulation between adjacent conductors and packages, defines the through-holes for conductor placement, and facilitates attachment to semiconductor package lateral surfaces. This multi-functionality reduces the need for additional separate components, managing device complexity while achieving compact SiP system size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The bridge conductors are nested within the through-holes of the central insulating layer, which is itself nested between the top and bottom insulating layers of the insulating frame. This nested structure efficiently utilizes space, allowing multiple conductors to be organized in a compact arrangement that reduces the overall SiP system volume while maintaining manageable structural complexity.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Length of moving object

If bridge conductors are disposed within through-holes of the central insulating layer, then electrical connections are achieved with reduced distance, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedistance between semiconductor packagesVSAvoidbridge conductor positioning

Core Design Contradiction:

Length of moving objectVSManufacturing precision

Solution Approach 1:

The through-holes are pre-formed in the central insulating layer before the bridge conductors are disposed within them. This preliminary action provides predetermined positioning guides that simplify the subsequent conductor placement process, reducing the actual manufacturing precision required during assembly while still achieving the goal of reduced distance between semiconductor packages.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The central insulating layer acts as an intermediary structure that mediates between the top and bottom insulating layers, providing a structured framework with pre-defined through-holes. This intermediary component facilitates the precise positioning of bridge conductors without requiring direct high-precision alignment between multiple complex components, thereby reducing manufacturing precision requirements while achieving compact packaging.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20260033356A1Method for forming an interconnect device and a method for forming a semiconductor package assembly

Publication Date: 2026.01.29 STATS CHIPPAC LTD

AI summary

A method for forming an interconnect device. The method comprises: forming an insulating frame, wherein the insulating frame comprises: a top insulating layer formed uppermost of the insulating frame; a bottom insulating layer formed lowermost of the insulating frame; and a central insulating layer that includes a plurality of insulators disposed between the top insulating layer and the bottom insulating layer; and forming a plurality of bridge conductors extending between a first lateral surface and a second lateral surface of the central insulating layer.