Lateral Bump Structure for Semiconductor Package Interconnection
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Solution Overview
Problem
The miniaturization of semiconductor devices complicates manufacturing, leading to issues such as poor electrical interconnection, cracks, and delamination, particularly due to the complexity of creating effective signal paths between devices without increasing package height or fabrication costs.
Innovation Solution
A semiconductor package with a bump structure that implements a lateral signal path between laterally adjacent devices, eliminating the need for a redistribution structure, thereby reducing package height and fabrication costs while maintaining effective electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used for miniaturized semiconductor devices, then device functionality is achieved, but manufacturing complexity increases leading to poor electrical interconnection, cracks, and delamination
Solution Approach 1:
The bump structure extends laterally across the side of the first device, transitioning from conventional vertical interconnection to a lateral signal path that traverses the device side, thereby simplifying the manufacturing process while maintaining electrical connection quality
Solution Approach 2:
The bump structure merges multiple functions into a single component: it provides electrical connection, extends laterally to bridge adjacent devices, and fills missing corners to maintain structural integrity, eliminating the need for separate redistribution structures
2Reliability
If redistribution structures are used to create lateral signal paths, then electrical connectivity is improved, but package height and fabrication costs increase
Solution Approach 1:
Instead of using a redistribution structure that increases vertical package height, the bump structure creates a lateral signal path by extending across the side of the device, moving the interconnection approach from vertical to lateral dimension
Solution Approach 2:
The invention extracts and eliminates the need for separate redistribution structures by integrating the lateral signal path function directly into the bump structure that extends across the device side
3Manufacturing precision
If more manufacturing steps are undertaken to achieve effective signal paths, then electrical interconnection is improved, but fabrication costs increase
Solution Approach 1:
The bump structure combines multiple functions into a single manufacturing step: electrical connection, lateral signal path creation, and corner filling, thereby reducing the number of separate manufacturing steps and associated costs
Solution Approach 2:
The bump structure serves multiple purposes simultaneously: it provides electrical interconnection, creates lateral signal paths between adjacent devices, and fills missing corners to maintain structural integrity, making it a universal solution that eliminates the need for multiple specialized components
Data Source
AI summary
The present disclosure provides a method for preparing a semiconductor package. The method includes providing a first device having a first upper surface and a first side, wherein the first upper surface and the first side form a first corner. The method also includes forming a bump structure over the first upper surface, wherein the bump structure extends laterally across the first side of the first device.