Lateral Conductive Routing for Thin Multi-Chip Electronic Packaging
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Solution Overview
Problem
Conventional 3D and 2.5D stacking techniques for electronic components face issues such as large thickness, alignment challenges between solder balls and interposers, and sensitivity to warpage, which hinder process optimization.
Innovation Solution
The proposed electronic device integrates a first electronic component with multiple second electronic components and conductive elements, where the second components are disposed under the first component, and the conductive elements electrically connect them without vertically overlapping the second components, thereby optimizing the stacking process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional 3D stacking technique is used to integrate electronic components, then electronic components can be stacked vertically, but the overall thickness of the device becomes relatively large
Solution Approach 1:
The patent transitions from conventional vertical 3D stacking to a 2.5D stacking approach where conductive elements extend laterally underneath the first electronic component rather than vertically through it. This dimensional change allows components to be integrated while reducing the vertical thickness of the device structure.
Solution Approach 2:
The conductive elements are segmented into multiple portions (first conductive element portion, second conductive element portion) that are distributed at different horizontal positions. This segmentation allows the conductive path to route around the second electronic component's projection area, avoiding vertical overlap and reducing overall device thickness.
2Length of stationary object
If conventional 2.5D stacking technique is used to integrate electronic components, then device thickness can be reduced, but alignment between solder balls and interposer becomes challenging and sensitive to warpage
Solution Approach 1:
The patent introduces a circuit board as an intermediary substrate that provides a stable reference plane for mounting the first electronic component. The conductive elements are formed on this intermediary substrate, which helps maintain alignment precision and reduces sensitivity to warpage compared to direct solder ball-to-interposer alignment.
Solution Approach 2:
The conductive elements are preliminarily formed on the circuit board before the first electronic component is mounted. This preliminary formation of conductive paths allows for better control of alignment and positioning, reducing the sensitivity to warpage that occurs when alignment must be achieved during the stacking process itself.
3Reliability
If conventional stacking techniques with solder joints and silicon interposers are used, then electrical connection can be established, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent extracts and eliminates the silicon interposer from the conventional stacking structure. Instead of using a separate interposer substrate, the conductive elements are directly formed on the circuit board to provide electrical connections, simplifying the manufacturing process while maintaining reliable electrical connectivity between components.
Solution Approach 2:
The patent merges the functions of the interposer and the circuit board into a single structure. The circuit board simultaneously serves as the mounting substrate for the first electronic component and as the carrier for the conductive elements that provide electrical connections to the second electronic component, eliminating the need for a separate interposer layer.
Data Source
AI summary
An electronic device is provided. The electronic device includes a first electronic component, a plurality of second electronic components, and a plurality of conductive elements. The plurality of second electronic components are disposed under the first electronic component. The plurality of conductive elements electrically connect the first electronic component to the plurality of second electronic components. The plurality of conductive elements are free from vertically overlapping the plurality of second electronic components.