Lateral Cooling for Multi-Chip Packages with Upstream IC Orientation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip packaging schemes with through-silicon-via (TSV) interposers face challenges in managing IC dies with different temperature sensitivities, as larger heat sinks and spreaders are costly and increase manufacturing complexity.
Innovation Solution
The IC dies are arranged such that the die with greater temperature sensitivity is positioned upstream of the die with lesser sensitivity relative to the direction of cooling fluid flow, preventing heat transfer and allowing for efficient cooling without costly countermeasures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If larger heat sinks and heat spreaders are used to cool temperature-sensitive IC dies, then the temperature sensitivity problem is resolved, but the expense and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by directing cooling fluid to flow across specific IC dies in a predetermined sequence, providing targeted cooling to temperature-sensitive dies without requiring larger heat sinks or spreaders for all dies. This localized cooling approach resolves the temperature sensitivity issue while avoiding increased manufacturing complexity.
Solution Approach 2:
The patent implements preliminary action by pre-positioning the IC dies in a specific spatial arrangement on the substrate before operation, with temperature-sensitive dies placed upstream in the cooling fluid flow path. This preliminary positioning ensures that cooling occurs in the correct sequence without requiring complex active control mechanisms.
2Reliability
If larger heat sinks and heat spreaders are used to cool temperature-sensitive IC dies, then the temperature sensitivity problem is resolved, but the package size exceeds design criteria
Solution Approach 1:
The patent applies local quality by directing cooling fluid to flow across specific IC dies in a predetermined sequence, providing targeted cooling to temperature-sensitive dies without requiring larger heat sinks or spreaders for all dies. This localized cooling approach resolves the temperature sensitivity issue while avoiding increased manufacturing complexity.
3Productivity
If IC dies with different temperature sensitivities are mounted on the same substrate, then functionality and component density are improved, but heat management becomes problematic
Solution Approach 1:
The patent applies local quality by directing cooling fluid to flow across specific IC dies in a predetermined sequence, providing targeted cooling to temperature-sensitive dies. This allows different types of IC dies with different temperature sensitivities to be mounted on the same substrate while managing heat effectively through selective cooling zones.
Solution Approach 2:
The patent implements preliminary action by pre-positioning the IC dies in a specific spatial arrangement on the substrate before operation, with temperature-sensitive dies placed upstream in the cooling fluid flow path. This preliminary positioning enables effective heat management for high-density packaging without requiring complex active control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement enables better device performance over a wider range of operating conditions with reduced expense and complexity, allowing dies with different sensitivities to be used in a single package without excessive heating.
Implementation Method 1
inducing a flow of cooling fluid within a housing of an electronic device, the flow having a direction defined by the cooling fluid flowing across a first IC die and a second IC die
Data Source
AI summary
A method and apparatus are provided that includes an electronic device, a chip package and a method for cooling a chip package in an electronic device. In one example, the chip package includes an interposer or package substrate having a first IC die and a second IC die mounted thereon. The second IC die has a maximum safe operating temperature that is greater than a maximum safe operating temperature of the first IC die. An indicia is disposed on the chip package. The indicia designates an installation orientation of the interposer or package substrate which positions the first IC die upstream of the second IC die relative to a direction of cooling fluid flow.