Lateral Face Board Attachment for Narrow Border Electronics

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Solution Overview

Problem

The challenge lies in creating electronic devices with a narrow border design that enhances product competitiveness, as existing technologies struggle to effectively integrate components while maintaining electrical connectivity and structural integrity.

Innovation Solution

The solution involves an electronic device comprising a component board, a connecting board, an attaching member, and a conductive member, where the connecting board is aligned with the component board's lateral face using an attaching member, and a conductive member is placed in a recess formed by the substrate, attaching member, and connecting board to establish electrical connection between the first and second conductive wires.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If components are integrated to achieve narrow border design, then the device border width is reduced, but electrical connectivity and structural integrity become difficult to maintain

Engineering Contradiction:
Improvedevice border widthVSAvoidelectrical connectivity
Core Design Contradiction:
Length of stationary objectVSReliability

Solution Approach 1:

The connecting board is attached to the lateral face of the substrate rather than the front surface, utilizing the side dimension to route connections. This allows conductive wires to extend along the lateral face and connect to the conductive member in the recess, maintaining electrical connectivity while preserving the narrow border appearance from the front view.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive member is positioned within a recess formed by the substrate, attaching member, and connecting board. This nested structure embeds the connection components within the device thickness, preventing them from protruding and maintaining the narrow border profile while ensuring reliable electrical contact between components.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Length of stationary object

If components are integrated to achieve narrow border design, then the device border width is reduced, but structural integrity becomes difficult to maintain

Engineering Contradiction:
Improvedevice border widthVSAvoidstructural integrity
Core Design Contradiction:
Length of stationary objectVSStrength

Solution Approach 1:

The attaching member is disposed between the lateral face of the substrate and the connecting board before final assembly, pre-establishing the mechanical connection. This preliminary positioning ensures that the connecting board is securely attached to the substrate's lateral face, maintaining structural integrity while enabling the narrow border configuration.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The recess structure embeds the conductive member and connecting board interface within the device body, protecting these critical connection points from external mechanical stress. This nested arrangement maintains structural integrity by shielding vulnerable components while preserving the narrow external profile.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Productivity

If multiple components are tiled together, then the device density is increased, but manufacturing complexity increases

Engineering Contradiction:
Improvedevice densityVSAvoidmanufacturing complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The connecting board serves multiple functions: it provides mechanical attachment to the substrate via the attaching member, establishes electrical connectivity through the conductive member, and enables the narrow border design. This multi-functionality reduces the need for separate components and simplifies the manufacturing process for high-density device configurations.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The device is segmented into modular components (substrate, connecting board, attaching member, conductive member) that can be independently manufactured and then assembled. This segmentation allows for standardized production of each component and simplifies the tiling process for creating high-density device arrays.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10573597B1Electronic device and manufacturing method thereof
Publication Date: 2020.02.25 GIO OPTOELECTRONICS CORP
  • US10573597B1 patent drawing
  • US10573597B1 patent drawing
  • US10573597B1 patent drawing

AI summary

An electronic device and manufacturing method thereof are disclosed. The manufacturing method includes steps of: providing a component board, wherein the component board comprises a substrate and a first conductive wire; providing a connecting board, wherein the connecting board comprises a second conductive wire; disposing an attaching member on the connecting board or a lateral face of the substrate; aligning the second conductive wire of the connecting board toward the lateral face, and attaching the connecting board to the lateral face by the attaching member, wherein the lateral face, the attaching member and the connecting board form a recess; and disposing a conductive member in the recess, wherein the conductive member contacts the first conductive wire and the second conductive wire, and the first conductive wire is electrically connected with the second conductive wire through the conductive member.