Integrated Circuit Package with Lateral Fiber Optical Coupling

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The semiconductor industry faces challenges in achieving smaller and more creative packaging techniques for semiconductor dies as demand grows for shrinking electronic devices, particularly in integrating optical components with high bandwidth and low power consumption.

Innovation Solution

The integration of optical integrated circuit dies with grating couplers, lens adapters, and mirrors in specific configurations allows for compact packaging with lateral entry optical fibers, reducing optical loss and enabling extensive integration in various packaging configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional packaging techniques are used, then manufacturing simplicity is maintained, but device size cannot be reduced further and integration density is limited

Engineering Contradiction:

Improvepackage sizeVSAvoidpackaging structure complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The package is divided into distinct functional layers: substrate, interposer, optical die, and electronic die. Each layer performs specific functions and can be manufactured separately, then assembled together. This segmentation allows for reduced overall package size while maintaining manufacturing simplicity through modular assembly processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar 2D packaging to 3D vertical stacking by introducing an interposer layer that enables through-silicon via (TSV) connections. This dimensional change allows multiple dies to be stacked vertically, significantly reducing the footprint area while maintaining electrical and optical connectivity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If optical components are integrated into the package, then bandwidth and power efficiency are improved, but manufacturing complexity and alignment precision requirements increase

Engineering Contradiction:

Improvedata transmission bandwidthVSAvoidoptical component alignment precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

An interposer layer is introduced as an intermediary between the optical die and electronic die. This interposer provides pre-fabricated TSV structures and alignment features that mediate the connection between components, reducing the direct alignment precision requirements between the optical and electronic dies while enabling high-bandwidth data transmission.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The interposer is prepared in advance with pre-formed TSV structures and alignment features before the final assembly. This preliminary action allows alignment features to be pre-positioned with high precision during interposer fabrication, which then guides the subsequent assembly of optical and electronic dies, reducing the overall manufacturing precision requirements.

Inventive Principle:

Principle #10Preliminary action

3Volume of moving object

If smaller package sizes are achieved, then device miniaturization is accomplished, but heat dissipation becomes more challenging

Engineering Contradiction:

Improvepackage volumeVSAvoidheat dissipation efficiency

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The package structure segments heat generation sources into distinct layers: the optical die generates heat during laser operation, while the electronic die generates heat during signal processing. The interposer layer acts as a thermal management interface with TSV structures that provide thermal pathways, allowing heat to be conducted vertically to heat sinks on the substrate, maintaining efficient heat dissipation in the compact 3D structure.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration achieves high bandwidth with ultra-low power consumption and reduces optical loss, making it suitable for multi-chip modules, chip-on-wafer-on-substrate packages, and integrated fan-out packages.

Implementation Method 1

The optical die includes an optical coupler

Methodology Applied

Scientific EffectOptical coupling:

Implementation Method 2

integration of optical integrated circuit dies with grating couplers

Methodology Applied

Scientific EffectGrating diffraction: Diffraction Grating

Data Source

PatentUS12411279B2Integrated circuit package and method of forming same

Publication Date: 2025.09.09 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An embodiment is a package including a package substrate and a package component bonded to the package substrate, the package component including an interposer, an optical die bonded to the interposer, the optical die including an optical coupler, an integrated circuit die bonded to the interposer adjacent the optical die, a lens adapter adhered to the optical die with a first optical glue, a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die, and an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such that an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.