Lateral Heat Pipe Cooling for Thin Computer Cases
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In modern computing devices with thin profiles, the limited space within the computer case poses a challenge for effectively cooling heat-generating components like CPUs, chipsets, and graphics cards, as traditional cooling systems struggle to fit sufficient cooling components.
Innovation Solution
A computer cooling system utilizing a heat pipe with an evaporator portion thermally coupled to the component via a conductive sheet, positioned laterally or horizontally adjacent to the component, allowing for efficient heat transfer without direct mechanical contact, thereby maintaining a slim form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling systems are used to cool heat-generating components, then effective heat removal is achieved, but the computer case thickness increases due to insufficient space for cooling components
Solution Approach 1:
The patent transitions from vertical stacking (z-dimension) to lateral placement (x-y plane) of the heat pipe evaporator. By positioning the evaporator portion laterally adjacent to the heat-generating component rather than directly above or below it, the system achieves effective heat removal while minimizing the vertical thickness of the computer case.
Solution Approach 2:
The patent introduces a thermal coupling element as an intermediary between the heat pipe evaporator and the heat-generating component. This thermal coupling element enables heat transfer from the component to the evaporator without requiring direct mechanical contact, allowing flexible lateral positioning that maintains thin case profiles.
2Loss of energy
If the evaporator portion is placed directly above the component, then heat transfer efficiency is maximized, but the vertical clearance requirement increases
Solution Approach 1:
The thermal coupling element serves as a mediator that bridges the gap between the laterally positioned evaporator and the heat-generating component. This intermediary enables effective heat transfer without requiring the evaporator to be positioned directly above the component, thereby reducing vertical clearance requirements while maintaining thermal efficiency.
Solution Approach 2:
The patent changes the spatial parameter from vertical alignment to lateral adjacency. By modifying the positional relationship between the evaporator and component from vertical to lateral, the system achieves comparable heat transfer efficiency while significantly reducing the vertical clearance requirement.
3Length of stationary object
If lateral placement of evaporator is used to reduce case thickness, then direct mechanical contact is avoided, but thermal coupling challenge arises
Solution Approach 1:
The thermal coupling element is specifically designed as a flexible intermediary that bridges the lateral gap between the evaporator and component. This element simplifies the thermal coupling challenge by providing a compliant interface that maintains thermal contact without requiring precise mechanical alignment or direct rigid contact.
Solution Approach 2:
The thermal coupling element is implemented as a thin, flexible thermal interface material that can conform to the surfaces of both the evaporator and heat-generating component. This flexible film approach simplifies thermal coupling by accommodating manufacturing tolerances and surface irregularities without requiring complex mechanical contact arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat removal from heat-generating components while maintaining a thin computer case design, as the heat pipe's evaporator portion can be placed adjacent to the component without increasing the minimum vertical clearance, allowing for thinner computer enclosures.
Implementation Method 1
An evaporation-condensation cycle of a working fluid transfers heat from an evaporator portion to a condenser portion of the heat pipe
Implementation Method 2
uses a heat pipe to remove heat generated by the computer component
Implementation Method 3
A thermal coupling element (e.g., a metal foil, a graphite or graphene sheet) extends from the evaporator portion of the heat pipe to the computer component
Implementation Method 4
A pressing element is attached to the second wall directly over the computer component extending from the first wall. The pressing element has a surface that presses against a surface of the computer component
Data Source
AI summary
A method of using a heat pipe to spot cool a component in a computer case involves disposing an evaporator portion of the heat pipe to be laterally or horizontally adjacent to, but not in direct contact with, the component in the computer case. The method further involves thermally coupling the laterally adjacent component and the evaporator portion of the heat pipe with a bridging heat transfer component.