Lateral Interconnect Structure for Tighter Semiconductor Package Spacing

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Solution Overview

Problem

The challenge in the semiconductor industry is to reduce the distance between semiconductor packages to achieve smaller, faster, and higher-performance System-in-Package (SiP) systems.

Innovation Solution

An interconnect device comprising an insulating frame with multiple layers and bridge conductors is used to electrically connect adjacent semiconductor packages, reducing the distance between them by connecting through lateral surfaces rather than bottom surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If conventional bottom-surface connection methods are used to connect semiconductor packages, then electrical connections can be established, but the distance between semiconductor packages cannot be reduced sufficiently

Engineering Contradiction:

Improvedistance between semiconductor packagesVSAvoidconnection method complexity

Core Design Contradiction:

Length of moving objectVSEase of manufacture

Solution Approach 1:

The patent transitions from conventional bottom-surface connection (vertical dimension) to lateral-surface connection (horizontal dimension). The interconnect device connects semiconductor packages through their side surfaces rather than bottom surfaces, enabling reduced pitch and smaller package sizes while maintaining electrical connection functionality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces an interconnect device as an intermediary component between semiconductor packages. This device includes bridge conductors embedded in an insulating frame, serving as a mediator that facilitates lateral-surface electrical connections and enables reduced distance between packages.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If the distance between semiconductor packages is reduced, then SiP system size decreases, but manufacturing precision requirements increase

Engineering Contradiction:

ImproveSiP system sizeVSAvoidalignment precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The insulating frame includes positioning structures such as guide holes and positioning protrusions that enable self-alignment during assembly. The bridge conductors are pre-positioned within the insulating frame, allowing automatic alignment with corresponding pads on semiconductor packages, thereby reducing the need for high-precision external alignment processes.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces complex mechanical alignment systems with a simplified structure where the insulating frame provides inherent positioning guidance. The guide holes and positioning protrusions create a mechanical guide system that automatically ensures precise alignment during assembly, reducing manufacturing complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Length of moving object

If lateral surface connection is implemented, then distance between packages is reduced, but device structure complexity increases

Engineering Contradiction:

Improvedistance between semiconductor packagesVSAvoidinterconnect device structure

Core Design Contradiction:

Length of moving objectVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into a single interconnect device structure. The insulating frame simultaneously provides electrical insulation, mechanical support, positioning guidance, and structural integrity. The bridge conductors integrated within the frame provide both electrical connection and structural stability, reducing the need for separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The interconnect device uses composite construction combining insulating frame material (providing electrical isolation and mechanical support) with conductive bridge materials (providing electrical connection). This composite structure achieves multiple functions—electrical connection, insulation, and mechanical strength—within a single integrated device.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12456689B2Interconnect device and semiconductor assembly incorporating the same

Publication Date: 2025.10.28 STATS CHIPPAC LTD

AI summary

An interconnect device comprises an insulating frame. The insulating frame comprises: a top insulating layer formed uppermost of the insulating frame and occupying an entirety of a top surface of the insulating frame; a bottom insulating layer formed lowermost of the insulating frame and occupying an entirety of a bottom surface of the insulating frame; and a central insulating layer that includes a plurality of insulators disposed between the top insulating layer and the bottom insulating layer, wherein the plurality of insulators form a plurality of through-holes between a first lateral surface and a second lateral surface of the central insulating layer. The interconnect device further comprises a plurality of bridge conductors, wherein each of the plurality of bridge conductors is disposed within a respective one of the plurality of through-holes and extends between the first lateral surface and the second lateral surface of the central insulating layer.