Lateral Light Emission LED Display Structure
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Solution Overview
Problem
Conventional LED display devices require a thick wavelength conversion material layer for efficient light emission, which increases the overall thickness and manufacturing complexity.
Innovation Solution
The LED display device incorporates an array substrate, opposite substrate, wall structures, upper and lower reflection layers, and a light diffusion material layer, allowing LEDs to emit light laterally without the need for a wavelength conversion material layer on the light-emitting surface, thereby reducing the overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a thick wavelength conversion material layer is used to achieve efficient light emission, then light emission efficiency is improved, but the overall thickness of the device increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from vertical light emission (top-emitting) to lateral light emission (side-emitting) by changing the spatial dimension of light extraction. The LED structure emits light from the side surface rather than the top surface, allowing the light path to extend horizontally through the device thickness direction, thereby reducing the required thickness of the wavelength conversion layer while maintaining efficient light emission.
Solution Approach 2:
The patent inverts the conventional top-emitting LED structure to a side-emitting configuration. Instead of placing the wavelength conversion layer on top of the LED and extracting light vertically, the structure is inverted to emit light laterally from the side, with the wavelength conversion layer positioned to convert light along the horizontal path, thus reducing the thickness requirement.
2Illumination intensity
If a thick wavelength conversion material layer is used to achieve efficient light emission, then light emission efficiency is improved, but manufacturing complexity increases due to excessive stacking thickness
Solution Approach 1:
By changing from vertical to lateral light emission, the patent reduces the stacking thickness in the vertical direction, making the manufacturing process more manageable. The lateral emission configuration allows for thinner layer stacking while maintaining the light conversion function, thereby reducing manufacturing complexity associated with handling thick stacked structures.
3Illumination intensity
If a thick wavelength conversion material layer is used, then wavelength conversion efficiency is improved, but the overall structure thickness increases
Solution Approach 1:
The patent extends the light conversion path from the vertical dimension to the horizontal dimension. By emitting light laterally, the structure allows the wavelength conversion layer to function effectively with reduced vertical thickness, as the light travels through the conversion layer along the horizontal axis rather than requiring a thick vertical stack.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a thinner LED display device structure while maintaining efficient light emission and improving light mixing effects, reducing manufacturing difficulties.
Implementation Method 1
The upper reflection layer is disposed between the at least one LED and the opposite substrate. The orthographic projection of the upper reflection layer on the array substrate is at least partially overlapped with the orthographic projection of the at least one light-emitting diode.
Implementation Method 2
The light diffusion material layer is filled in the at least one accommodating region... the LED can emit lights from a lateral direction... improving light mixing effects
Implementation Method 3
The lower reflection layer is disposed on the array substrate, and is located in the at least one accommodating region. An orthographic projection of the upper reflection layer on the array substrate is at least partially overlapped with an orthographic projection of the lower reflection layer on the array substrate.
Data Source
AI summary
A light emitting diode (LED) display device including an array substrate, an opposite substrate, wall structures, at least one LED, an upper reflection layer, a first light barrier layer, a lower reflection layer and a light diffusion material layer. The array substrate, the wall structures and the opposite substrate define an accommodating region. The upper reflection layer is disposed on the LED, wherein the upper reflection layer at least partially covers an upper surface of the LED. The first light barrier layer is disposed on a side of the upper reflection layer away from the array substrate. An orthographic projection of the upper reflection layer on the array substrate is at least partially overlapped with an orthographic projection of the lower reflection layer on the array substrate. The light diffusion material layer is filled in the accommodating region.