Lateral Magnetic Field Source for Compact Sensor Assembly
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Solution Overview
Problem
Conventional magnetic field sensor assemblies with integrated magnetic field sources are bulky, making them unsuitable for installation in narrow spaces due to their large dimensions.
Innovation Solution
The magnetic field source is positioned laterally adjacent to the semiconductor chip, allowing for a flat design and reduced height, with optional configurations using permanent magnets, field coils, and calibration coils to enhance sensitivity and adjustability, and multiple sources for symmetrical or asymmetrical magnetic flux distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the magnetic field source is integrated into the magnetic field sensor assembly, then the assembly effort and expense are reduced, but the dimensions of the assembly become relatively large
Solution Approach 1:
The patent repositions the magnetic field source from a conventional stacked arrangement (above or below the semiconductor chip) to a lateral arrangement (adjacent to the chip in the same plane). This dimensional change allows the magnetic field source and sensor to coexist in the same plane without increasing the overall height of the assembly, thus reducing the vertical dimension while maintaining integration benefits
Solution Approach 2:
The patent employs an asymmetrical layout where the magnetic field source is positioned laterally adjacent to the semiconductor chip rather than symmetrically above or below it. This asymmetrical positioning optimizes the magnetic flux path and allows for a more compact overall assembly footprint, particularly reducing the height dimension
2Volume of moving object
If the magnetic field sensor assembly is designed with reduced height for flat design shape, then it becomes suitable for narrow gaps, but the magnetic flux density may be affected
Solution Approach 1:
By moving the magnetic field source to a lateral position adjacent to the semiconductor chip, the patent creates an optimized magnetic flux path that travels through the encapsulation material directly to the sensor. This lateral arrangement maintains effective magnetic coupling while significantly reducing the vertical height of the assembly, making it suitable for narrow gap applications
Solution Approach 2:
The patent ensures that the encapsulation material surrounding the magnetic field source and sensor has specific magnetic properties that facilitate efficient flux transmission. The local arrangement of components and materials is optimized to maintain high magnetic flux density at the sensor location despite the reduced overall assembly height
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a compact, sensitive, and adjustable magnetic field sensor assembly that can detect changes in magnetic conductivity and extraneous fields with high precision, suitable for various applications including absolute distance measurements.
Implementation Method 1
the magnetic flux produced by the permanent magnet flows through the gear
Implementation Method 2
A Hall-effect sensor is integrated in the semiconductor chip as a magnetic field sensor
Data Source
AI summary
A magnetic field sensor assembly has at least one magnetic field sensor integrated into a semiconductor chip and has at least one magnetic field source. The semiconductor chip and the at least one magnetic field source are arranged in an encapsulation material in a predetermined position relative to each other in such a way that a magnetic field generated by the magnetic field source is detectable with the aid of at least one magnetic field sensor. The magnetic field source is arranged in the semiconductor chip and/or in the plane of extension of the semiconductor chip laterally adjacent to said chip.