Lateral Fluid Nozzle Arrays for Uniform Semiconductor Module Temperature Control
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Solution Overview
Problem
Existing semiconductor module testing equipment faces challenges in accurately and uniformly maintaining temperature distribution during high and low temperature testing due to heat generation by the semiconductor modules, leading to inefficient and unreliable testing results.
Innovation Solution
The equipment incorporates a pipe structure with nozzle arrays that discharge heating or cooling fluids directly towards the semiconductor stacks, ensuring stable and reliable temperature control by preventing distortion of the fluid flow due to heat emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heating or cooling is performed using a heater, fan, and temperature sensor in a chamber, then the temperature can be controlled to a predetermined level, but the temperature distribution becomes non-uniform when the semiconductor module generates heat during testing
Solution Approach 1:
The chamber is divided into multiple temperature control zones with separate pipe structures and nozzles positioned at different locations. Each zone can independently receive heating or cooling fluid through dedicated nozzles, allowing localized temperature adjustment to compensate for heat generated by semiconductor modules during testing.
Solution Approach 2:
Different regions of the chamber are provided with different temperature control characteristics through strategically positioned nozzles and pipe structures. The system applies localized heating or cooling directly where needed, particularly near the semiconductor module testing positions, to maintain uniform temperature distribution despite local heat generation.
2Productivity
If the semiconductor module generates heat during testing, then the testing operation can proceed, but accurate and uniform temperature maintenance becomes difficult
Solution Approach 1:
The pipe structures continuously supply heating or cooling fluid through multiple nozzles during the entire testing process. This continuous fluid circulation ensures that temperature control is maintained throughout the testing operation, allowing the semiconductor module to generate heat while the system actively compensates to maintain reliable temperature conditions.
Solution Approach 2:
Heating or cooling fluid acts as an intermediary medium that transfers thermal energy from the pipe structures to the chamber environment. The fluid circulates through the pipe network and exits via nozzles, providing indirect but effective temperature control that maintains reliability even when the semiconductor module generates heat during testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform temperature retention across semiconductor modules, enhancing the reliability and accuracy of performance testing by directly ejecting fluids towards the stacks, thus overcoming the issue of non-uniform temperature distribution caused by heat emission.
Implementation Method 1
a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally
Implementation Method 2
ensuring stable and reliable temperature control by preventing distortion of the fluid flow due to heat emission
Data Source
AI summary
Semiconductor module testing equipment includes a test board, a plurality of pipe structures extending from an upper surface of the test board in a first direction and spaced apart from one another in a second direction that intersects the first direction, wherein the first and second directions are substantially parallel to a plane of the test board, at least one semiconductor module socket disposed between a pair of neighboring pipe structures of the plurality of pipe structures, and a plurality of nozzles disposed on each pipe structure of the plurality of pipe structures, wherein the plurality of nozzles is configured to discharge a fluid laterally.