Lateral Optical Lens Coupling for High-Density PIC Packaging
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Solution Overview
Problem
Current photonic integrated circuit (PIC) packaging architectures face challenges in achieving high-density, high-bandwidth electrical communication and simultaneous optical access, with existing methods requiring substantial PIC area for fiber coupling, limiting electrical interconnect density and supporting small footprint PICs.
Innovation Solution
A photonic packaging architecture that includes a package substrate, an IC, an insulating material, a PIC with an active side and a lateral side perpendicular to the active side, and an optical lens coupled to the PIC on the lateral side, allowing for electrical coupling to the substrate and IC while maintaining optical access, using conductive pillars and interconnects for high-density connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional fiber coupling methods are used for PIC packaging, then optical access is achieved, but substantial PIC area is required for fiber coupling which limits electrical interconnect density
Solution Approach 1:
The patent couples the optical lens to the lateral side of the PIC (perpendicular to the active side) rather than the traditional top-side fiber coupling approach. This dimensional change allows optical access without consuming valuable top-side area, thereby enabling higher electrical interconnect density on the PIC surface.
Solution Approach 2:
The patent separates the optical coupling function from the electrical interconnection function by using different sides of the PIC. The lateral side is dedicated to optical lens coupling while the top surface is optimized for electrical interconnects, allowing both functions to operate independently without area conflict.
2Area of stationary object
If smaller footprint PICs are used to reduce packaging size, then area is reduced, but achieving high-density electrical communication and optical access simultaneously becomes more difficult
Solution Approach 1:
By moving optical coupling to the lateral side of the PIC, the patent enables smaller footprint designs without sacrificing optical access capability. This approach allows both high-density electrical communication and optical access to coexist in a compact form factor.
3Productivity
If lateral side optical coupling is implemented, then electrical interconnect density increases, but new packaging architecture complexity is introduced
Solution Approach 1:
The patent divides the PIC into functionally distinct regions: the lateral side for optical lens coupling and the top surface for electrical interconnects. This segmentation simplifies the overall packaging architecture by clearly separating optical and electrical functions, making the system easier to manufacture and assemble despite the novel configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This architecture enables smaller footprint PICs with increased electrical interconnect density and reduced power consumption, while maintaining optical signal integrity and efficiency, facilitating high-speed data transfer and cost-effective optical communication systems.
Implementation Method 1
an optical lens coupled to the PIC on the lateral side
Data Source
AI summary
Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include an integrated circuit (IC) in a first layer including an insulating material, wherein the IC is embedded in the insulating material; a PIC, having an active surface, in a second layer, wherein the second layer is on the first layer, the second layer includes the insulating material, and the PIC is embedded in the insulating material with the active surface facing the first layer and electrically coupled to the IC; and a housing, having an optical lens optically coupled to an internal surface of the housing, attached to the active surface of the PIC and extending from the active surface of the PIC through the insulating material in the first layer, wherein the internal surface of the housing is opposite the active surface of the PIC.