Lateral Optoelectronic Semiconductor Component for Low Profile Displays
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Solution Overview
Problem
Conventional optoelectronic semiconductor components for backlit liquid crystal displays in handheld devices face challenges in reducing structural height while maintaining sufficient luminous flux, and existing fabrication methods are not cost-effective or efficient.
Innovation Solution
An optoelectronic semiconductor component with a semiconductor chip having a semiconductor layer sequence that generates radiation, a molded body forming a mounting side surface, and a contact track for external electrical contacting, fabricated using a method involving regional encapsulation with a molding compound and singulation to create a compact, surface-mountable component with accessible contact areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional LED designs are used, then sufficient luminous flux can be achieved, but the structural height becomes too large for handheld devices
Solution Approach 1:
The patent reorients the LED structure from a vertical configuration to a lateral configuration. The radiation exit surface is positioned perpendicular to the mounting direction, allowing light to exit laterally rather than vertically. This dimensional change enables the LED to achieve sufficient luminous flux while maintaining a reduced structural height suitable for handheld devices.
Solution Approach 2:
The patent applies different functional properties to different regions of the LED structure. The side surface is designed with specific optical properties to facilitate lateral light extraction, while the mounting surface is optimized for electrical and mechanical connection. This local differentiation allows the LED to maintain compact height while preserving luminous output through optimized light extraction pathways at specific locations.
2Illumination intensity
If the structural height is reduced, then the component becomes suitable for handheld devices, but the luminous flux becomes insufficient
Solution Approach 1:
The patent transitions from vertical light emission to lateral light emission by repositioning the radiation exit surface perpendicular to the mounting direction. This allows the LED to extract and emit light through its side surface, effectively utilizing the lateral dimension for light output while maintaining a compact vertical profile suitable for thin handheld devices.
3Ease of manufacture
If conventional fabrication methods are used, then manufacturing can be performed, but the process is not cost-effective or efficient
Solution Approach 1:
The patent incorporates the mounting side surface and contact areas into the initial molding process of the semiconductor component. By forming these features during the primary molding operation rather than requiring subsequent machining or assembly steps, the fabrication process becomes more cost-effective and efficient while maintaining the required structural precision for height reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact semiconductor component with a small structural height that provides sufficient luminous flux, fabricated in a simple and cost-effective manner, suitable for applications in handheld devices.
Implementation Method 1
a semiconductor layer sequence (200) comprising an active region (20) that generates radiation
Data Source
AI summary
An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.