Lateral Surface Antenna in Semiconductor Package
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor package devices face challenges in reducing size while maintaining signal quality due to separate manufacturing of antennas and communication modules, leading to increased costs and longer RF signal transmission paths.
Innovation Solution
A semiconductor package device design that integrates an antenna on the lateral surface of a carrier substrate, allowing for a more compact form factor and improved signal performance by disposing the antenna on the substrate's lateral surfaces, along with a package body that encapsulates the electronic component and provides electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna and communication module are separately manufactured and placed on different parts of a circuit board, then each component can be manufactured independently, but the device size increases and manufacturing costs increase
Solution Approach 1:
The patent merges the antenna and communication module into a single integrated package structure. The antenna is formed on the lateral surface of the carrier substrate, while the communication module is mounted on the same carrier, and both are encapsulated together in one package body. This integration eliminates the need for separate manufacturing and assembly processes, reducing device size while maintaining manufacturing efficiency.
Solution Approach 2:
The patent utilizes the lateral surface of the carrier substrate to place the antenna pattern, moving the antenna from the traditional planar surface to a three-dimensional surface. This dimensional change allows the antenna and communication module to coexist in the same package footprint without interfering with each other, effectively reducing the overall device area while maintaining independent component functionality.
2Ease of manufacture
If the antenna and communication module are separately manufactured and placed on different parts of a circuit board, then each component can be manufactured independently, but manufacturing costs increase due to separate manufacturing processes
Solution Approach 1:
The patent combines multiple components (antenna, communication module, and package body) into a single integrated package. This merging allows all components to be manufactured and assembled in one continuous process on the same carrier substrate, eliminating the need for separate manufacturing lines and assembly steps. The result is reduced manufacturing complexity and lower production costs while maintaining the independence of each component's design and function.
3Area of stationary object
If the antenna is placed on the lateral surface of the carrier substrate, then the clean area for antenna placement increases, but the manufacturing process becomes more complex
Solution Approach 1:
The patent forms the antenna pattern on the lateral surface of the carrier substrate by extending conductive material from the front surface along the side of the carrier. This three-dimensional configuration increases the available antenna area without requiring additional planar space. The manufacturing process uses standard PCB trace extension techniques, maintaining process simplicity while achieving enhanced antenna performance through increased surface area.
Data Source
AI summary
A semiconductor package device includes a carrier, an electronic component, a package body and an antenna. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The electronic component is disposed on the first surface of the carrier. The package body is disposed on the first surface of the carrier and encapsulates the electronic component. The antenna is disposed on at least a portion of the lateral surface of the carrier.