Lateral Transfer Printing Notched Interconnects
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Solution Overview
Problem
Existing methods for electrically interconnecting small integrated circuits or chiplets to contact pads on a destination substrate are costly and complex, often requiring photolithographic processes that are expensive and involve multiple steps, and are complicated by topographical differences between the substrate and integrated circuits.
Innovation Solution
A micro-transfer print structure with interconnect structures featuring notches and notch conductors on the destination substrate, allowing for lateral transfer of electronic components with connection posts that physically and electrically connect to the substrate, using a method that reduces manufacturing steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photolithographic processes are used to form electrical connections between chiplets and contact pads, then electrical interconnection is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent divides the electrical connection structure into separate segments: pre-formed conductive posts on the chiplet and distinct interconnect structures with notches on the substrate. This segmentation allows each component to be manufactured independently using simpler processes, then assembled together, avoiding the need for complex photolithographic patterning to create continuous conductive paths.
Solution Approach 2:
The conductive posts are pre-formed on the chiplet before transfer, and the interconnect structures with notches are pre-formed on the substrate before chiplet placement. This preliminary action eliminates the need for subsequent photolithographic steps to create these features, simplifying the overall manufacturing process while ensuring reliable electrical connections.
2Reliability
If photolithographic processes are used to form electrical connections, then electrical interconnection is achieved, but manufacturing cost increases
Solution Approach 1:
By segmenting the connection structure into separate pre-formed components (conductive posts and interconnect structures), the patent eliminates expensive photolithographic materials and processing steps, thereby reducing manufacturing cost while maintaining reliable electrical interconnection.
Solution Approach 2:
The mechanical insertion of pre-formed conductive posts into notched interconnect structures creates self-aligned electrical connections without requiring expensive photolithographic alignment and patterning processes, reducing manufacturing cost while ensuring reliable connections.
3Productivity
If conventional transfer printing is used, then chiplets are transferred to substrate, but electrical connection formation becomes more difficult due to topographical differences
Solution Approach 1:
The patent introduces a vertical dimension with protruding interconnect structures and conductive posts, transforming the planar photolithographic connection approach into a three-dimensional mechanical insertion approach. This dimensional change allows electrical connections to be formed through simple vertical insertion after transfer, eliminating topographical complications.
Solution Approach 2:
The notched interconnect structures serve as mechanical intermediaries that bridge the topographical gap between the substrate plane and the chiplet contact pads. These intermediaries provide a pathway for conductive posts to reach the contact pads without requiring complex lateral routing through topographical variations.
Data Source
AI summary
A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.