Lateral Wiring for Micro-LED Mounting
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Solution Overview
Problem
The manufacturing of micro-LED display devices is challenging due to the need for high electrical conductivity and light transmissivity on the upper surface of light-emitting elements, which complicates the mounting process and increases costs.
Innovation Solution
A method involving a substrate with sub-pixels, first and second electrodes, and a resin member where the second electrode is exposed on the lateral surface and connected to a second wiring, allowing for efficient electrical connection without covering the light-emitting element, enabling cost-effective manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the upper surface of the light-emitting element is connected to wirings to provide high electrical conductivity, then the electrical connection is improved, but the light transmissivity deteriorates
Solution Approach 1:
The patent moves the wiring connection from the upper surface (2D plane) to the lateral surface (3D dimension) of the light-emitting element. The second electrode and second wiring are disposed on the lateral surface, allowing electrical connection without blocking the upper surface, thus maintaining both electrical conductivity and light transmissivity.
2Reliability
If the upper surface of the light-emitting element is covered with wirings to ensure electrical connection, then the electrical conductivity is improved, but the mounting process becomes more difficult and cost increases
Solution Approach 1:
The patent relocates the electrical connection interface from the upper surface to the lateral surface of the light-emitting element. This dimensional shift simplifies the mounting process as the second wiring can be formed on the lateral surface without requiring complex upper surface wiring operations, thereby reducing manufacturing difficulty and cost.
3Ease of manufacture
If the second electrode is disposed on the lateral surface and connected to second wiring, then the mounting process is simplified and manufacturing cost is reduced, but the electrical connection complexity increases
Solution Approach 1:
The patent divides the electrical connection function into two separate electrodes: the first electrode on the lower surface for first wiring connection, and the second electrode on the lateral surface for second wiring connection. This segmentation allows independent optimization of each connection interface, simplifying the overall mounting process while managing electrical connection complexity through functional separation.
Data Source
AI summary
A method of manufacturing a display device 1 includes: providing a substrate including sub-pixel defined therein and a first wiring disposed for the sub-pixel, and light-emitting element having a lower surface and a lateral surface and including a first electrode disposed on the lower surface, and a second electrode disposed on the lateral surface; mounting the light-emitting element and electrically connecting the first electrode to the first wiring; forming a resin member on the substrate and covering the light-emitting element; exposing an upper portion of the light-emitting element from an upper surface of the resin member such that the second electrode is partially exposed by removing an upper portion of the resin member; and forming a second wiring on the upper surface of the resin member excluding a portion of the light-emitting element exposed from the resin member and electrically connecting the second wiring to the second electrode.