Laterally Extended Heat Pipe for Multi-Source Motherboard Cooling
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Solution Overview
Problem
Traditional heat dissipating apparatuses are limited in effectively managing heat from multiple sources on a computer motherboard, such as the CPU and peripheral components, due to their design which primarily focuses on vertical heat pipe extensions and limited fan size, failing to integrate efficient heat dissipation for all heat sources.
Innovation Solution
A heat dissipating apparatus with laterally extended heat pipes and fins, where at least one heat pipe is transversally extended from the thermal conducting base to dissipate heat to a lateral side, allowing for improved heat distribution and dissipation across multiple heat sources, including the CPU and memory, using a combination of vertically and transversally extended heat pipes and strategically placed fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat pipe is extended vertically outward from the thermal conducting base, then the heat dissipating section can be situated precisely at the top of the heated section for effective single heat source cooling, but the apparatus cannot meet the heat dissipating requirement for multiple heat sources including peripheral electronic devices
Solution Approach 1:
The heat pipe transitions from a traditional vertical extension to a lateral extension configuration. The heat dissipating section is extended outward from a lateral side of the thermal conducting base rather than vertically from the top, enabling the apparatus to cover multiple heat sources across different spatial dimensions on the motherboard
2Area of stationary object
If a fan with a larger size is used for increasing the heat dissipating area, then the airflow coverage can be expanded, but the apparatus still cannot meet the heat dissipating requirement for multiple heat sources due to spatial limitations
Solution Approach 1:
Instead of relying solely on increasing fan size for vertical airflow coverage, the invention extends the heat pipe laterally to create additional heat dissipating sections in different spatial directions. This dimensional change allows multiple heat sources to be cooled effectively without requiring an oversized fan
3Adaptability or versatility
If the heat dissipating section is extended laterally from the thermal conducting base, then the heat dissipating apparatus can integrate cooling for multiple heat sources, but the traditional vertical fan installation arrangement is no longer applicable
Solution Approach 1:
The heat pipe is configured to extend laterally from the thermal conducting base, creating a heat dissipating section that can be positioned adjacent to multiple heat sources. This lateral extension geometry naturally accommodates fan installation in side-by-side configurations rather than requiring vertical mounting arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation capabilities by allowing for efficient heat transfer to a lateral side, effectively managing heat from multiple sources on a computer motherboard, including CPUs and memory, through the use of laterally extended heat pipes and strategically positioned fans, thereby improving overall cooling performance.
Implementation Method 1
the heat pipe having the high thermal conducting characteristic can conduct the heat absorbed by the thermal conducting base to each fin
Implementation Method 2
the heat pipe is used for connecting the thermal conducting base and the plurality of fins
Data Source
AI summary
A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.