Laterally Placed Capacitor Package Assembly for Space-Constrained PCBs

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Solution Overview

Problem

Existing capacitor designs cannot be placed upright in highly space-constrained environments due to the need for vertical orientation of conductive pins, limiting their application in compact electronic devices.

Innovation Solution

A laterally placed capacitor package assembly with a wound capacitor structure and a supporting structure that allows the capacitor to be disposed horizontally on a circuit substrate, featuring conductive pins that extend laterally without bending to connect to the substrate, and a supporting structure with positioning portions to secure the capacitor in place.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the capacitor is placed upright on the circuit substrate, then the conductive pins can be properly connected, but the capacitor cannot be used in highly space-constrained environments

Engineering Contradiction:

Improveplacement orientationVSAvoidspace requirement

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent transitions the capacitor from vertical placement to horizontal placement by changing the orientation dimension. The supporting structure enables the capacitor body to be disposed horizontally on the circuit substrate, utilizing the lateral dimension for placement while maintaining proper electrical connections through laterally extending conductive pins.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent inverts the conventional placement orientation of the capacitor. Instead of placing the capacitor upright with conductive pins extending vertically, the supporting structure enables the capacitor to be placed horizontally with conductive pins extending laterally, effectively reversing the traditional configuration to achieve space savings.

Inventive Principle:

Principle #13The other way round (Inversion)

2Adaptability or versatility

If the conductive pins are bent to achieve lateral connection, then horizontal placement is possible, but the structural integrity and reliability are compromised

Engineering Contradiction:

Improveplacement orientationVSAvoidconductive pin integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent inverts the conventional approach by designing the conductive pins to naturally extend laterally without bending. The supporting structure is configured to hold the capacitor body horizontally while the conductive pins maintain their straight configuration, eliminating the need for bending and preserving structural integrity and reliability.

Inventive Principle:

Principle #13The other way round (Inversion)

Data Source

PatentUS20240431032A1Laterally placed capacitor package assembly and assembly method thereof

Publication Date: 2024.12.26 APAQ TECH

AI summary

A laterally placed capacitor package assembly and an assembly method thereof are provided. The laterally placed capacitor package assembly includes a wound capacitor package structure and a capacitor supporting structure. The wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The capacitor supporting structure includes a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion. When the laterally placed capacitor package assembly is configured to be laterally disposed on a circuit substrate, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin can be laterally and electrically connected to the circuit substrate without bending.