Latex Polymerization Composition for Dip Molding
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Solution Overview
Problem
Conventional latex for dip molding faces challenges in achieving stability, high solid content, and low viscosity, leading to poor durability of dip molded articles when exposed to body fluids, and existing methods for improving mechanical properties are inadequate.
Innovation Solution
A composition for latex polymerization comprising a conjugated diene-based monomer, an ethylenically unsaturated nitrile monomer, and an ionic compound with controlled ionic conductivity, which results in a copolymer with a large particle diameter and high solid content, maintaining low viscosity and improved stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the solid content of latex is increased through concentration, then the viscosity increases rapidly above a certain content due to a decrease in particle stability
Solution Approach 1:
The patent applies parameter changes by controlling the ionic conductivity of the latex composition within a specific range (100-500 μs/cm) to achieve high solid content (40-60%) while maintaining particle stability and preventing rapid viscosity increase. This involves adjusting the balance between ionic compounds and other compositional parameters.
Solution Approach 2:
The patent uses composite materials by combining multiple components including conjugated diene-based monomers, ethylenically unsaturated nitrile monomers, ethylenically unsaturated acid monomers, and specific ionic compounds to create a stable latex system that maintains particle stability at high solid contents.
2Quantity of substance
If the solid content of latex is increased, then the viscosity increases rapidly, making it difficult to maintain low viscosity characteristics
Solution Approach 1:
The patent controls the ionic conductivity parameter within 100-500 μs/cm to enable high solid content (40-60%) while maintaining low viscosity characteristics, preventing the rapid viscosity increase that typically occurs with concentration.
3Strength
If conventional latex is used with excellent mechanical properties measured in air at room temperature, then the durability before use can be guaranteed, but the durability under actual use conditions is poor when exposed to body fluids
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating specific monomers (conjugated diene-based, ethylenically unsaturated nitrile, and ethylenically unsaturated acid) and controlling ionic conductivity to achieve both excellent mechanical properties and superior durability under actual use conditions when exposed to body fluids.
Solution Approach 2:
The patent creates a composite latex system combining multiple monomer types and ionic compounds that provides both excellent mechanical properties (tensile strength, elongation) and enhanced durability under actual use conditions, preventing deterioration when exposed to body fluids.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of high-quality dip molded articles with enhanced durability and mechanical properties, maintaining stability and low viscosity even at high solid content, effectively addressing the limitations of conventional latex.
Implementation Method 1
the composition has an ionic conductivity of 275 μs/cm or more
Implementation Method 2
a conjugated diene-based monomer; an ethylenically unsaturated nitrile monomer; and an ethylenically unsaturated acid monomer
Implementation Method 3
latex for dip molding polymerized using the same, which has an average particle diameter of 1,000 to 3,000 Å
Data Source
AI summary
Disclosed are a composition for latex polymerization including: a conjugated diene-based monomer; an ethylenically unsaturated nitrile monomer, an ethylenically unsaturated acid monomer, and an ionic compound and having an ionic conductivity of 275 μs/cm or more, a latex for dip molding polymerized therefrom, and a dip molded article using the same.