Lattice Chamber Surfaces for PVD Flaking and Contamination
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Solution Overview
Problem
The manufacturing of sub-half micron and smaller features in semiconductor devices faces challenges due to high film stress in PVD chamber components, leading to material flaking and increased contamination, which degrades circuit performance and requires frequent chamber cleaning.
Innovation Solution
The implementation of engineered complex surfaces with a lattice framework on chamber components, fabricated using additive manufacturing techniques, such as 3D printing, to enhance film adhesion and reduce thermal stress, thereby minimizing contamination and extending the mean time between chamber cleans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional smooth surfaces are used on chamber components, then manufacturing is simple, but film adhesion is poor and film stress is high causing flaking
Solution Approach 1:
The patent applies a lattice framework surface treatment specifically on chamber components where material deposition occurs. This local modification creates regions with enhanced surface area and mechanical interlocking capability without altering the entire component structure, thereby improving film adhesion and reducing film stress at critical locations while maintaining overall component simplicity
Solution Approach 2:
The lattice framework divides the continuous surface into discrete interconnected struts and openings. This segmentation increases the effective surface area available for film deposition and creates multiple anchoring points that distribute film stress, preventing the formation of large stressed regions that lead to flaking
2Object-affected harmful factors
If high film stress is not addressed, then manufacturing and operation are simple, but material flaking occurs causing contamination
Solution Approach 1:
The lattice framework is applied locally on chamber components subject to material deposition, creating zones with enhanced mechanical properties that specifically address film stress issues at critical locations while leaving other components unchanged, thus reducing contamination sources without requiring complex modifications throughout the entire chamber system
Solution Approach 2:
By segmenting the surface into a lattice structure with multiple small support elements, the system distributes film stress across numerous small regions rather than allowing stress to concentrate on large continuous surfaces, thereby preventing flaking and reducing contamination while maintaining reasonable structural complexity
3Productivity
If frequent chamber cleaning is performed, then contamination is reduced, but productivity decreases due to downtime
Solution Approach 1:
The lattice framework surface treatment is applied in advance to chamber components before operation. This preliminary modification creates surfaces that inherently resist material flaking and contamination accumulation, thereby extending the time between required cleaning operations and maintaining productivity while controlling contamination levels
Data Source
AI summary
Disclosed are embodiments for an engineered feature formed as a part of or on a chamber component. In one embodiment, a chamber component for a processing chamber includes a component part body having unitary monolithic construction. The component part body has an outer surface. An engineered complex surface is formed on the outer surface. The engineered complex surface has a first lattice framework formed from a plurality of first interconnected laths and a plurality of first openings are bounded by three or more laths of the plurality of laths.


