Lattice-Shaped Fin Structure for Cooling Power Semiconductor Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently cooling power modules due to high heat capacity and power consumption, leading to reduced life and reliability, and the manufacturing of pin fins is costly and complex.
Innovation Solution
A semiconductor device with a lattice-shaped fin structure is introduced, comprising stacked first and second lattice-shaped bodies with bars and trenches, allowing for enhanced cooling efficiency and easier manufacturing compared to traditional pin fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional pin fin structure is used for cooling, then the cooling function is provided, but the manufacturing cost is high and the structure is complex
Solution Approach 1:
The fin structure is divided into multiple lattice-shaped bodies stacked in sequence, with each body containing multiple bars forming trenches. This segmentation allows the complex cooling function to be achieved through modular, simpler units that can be manufactured independently and assembled, reducing overall manufacturing complexity while maintaining effective cooling surface area
Solution Approach 2:
The invention transitions from traditional two-dimensional fin structures to a three-dimensional lattice configuration with bars arranged in multiple directions (first direction, second direction, third direction) forming interconnected trenches. This dimensional transformation increases the cooling surface area and improves refrigerant flow distribution without requiring proportionally higher manufacturing complexity
2Power
If the power module operates at high power consumption, then the output performance is improved, but the heat capacity increases and cooling becomes insufficient
Solution Approach 1:
The lattice-shaped fin structure creates a porous-like configuration with multiple interconnected trenches formed by bars arranged in different directions. This porous structure increases the surface area-to-volume ratio, enabling more efficient heat dissipation from the power module while maintaining structural integrity under high power operation conditions
Solution Approach 2:
By arranging bars in three different directions (first, second, and third directions) and stacking multiple lattice bodies, the invention creates a three-dimensional heat dissipation network that captures thermal energy from multiple angles, significantly improving cooling capacity for high power consumption applications
3Reliability
If the lattice-shaped fin structure is used, then the cooling efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The fin structure is divided into multiple lattice-shaped bodies that can be manufactured as separate modules and then assembled. Each module contains standardized bar patterns that can be produced using conventional manufacturing techniques, reducing the overall precision requirements compared to manufacturing a single complex integrated structure
Solution Approach 2:
The lattice-shaped bodies are designed with repeating patterns of bars arranged in standard directions (first, second, third directions) with consistent spacing. This universal, modular design allows the same manufacturing process and precision standards to be applied repeatedly across all modules, simplifying quality control and manufacturing planning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lattice-shaped fin structure improves cooling efficiency, reduces manufacturing costs, and enhances the reliability and life of semiconductor devices by facilitating uniform refrigerant flow and reducing pressure loss.
Implementation Method 1
The lattice-shaped fin includes a plurality of first trenches and a plurality of second trenches, allowing for enhanced cooling efficiency and easier manufacturing compared to traditional pin fins
Implementation Method 2
The first lattice-shaped body and the second lattice-shaped body are stacked in a stack direction perpendicular to the first plane, improving cooling efficiency
Data Source
AI summary
According to one embodiment, the semiconductor device includes: a semiconductor module including a semiconductor chip having a first surface and a second surface; and a lattice-shaped fin close to the second surface side of the semiconductor chip. The lattice-shaped fin includes a first lattice-shaped body and a second lattice-shaped body, the first lattice-shaped body including a plurality of first bars each having a bar shape extending in a first direction, and being spaced from each other in an arrangement direction, thereby forming a plurality of first trenches between the adjacent first bars, and the second lattice-shaped body including a plurality of second bars each having a bar shape extending in a second direction, and being spaced from each other in the arrangement direction, thereby forming a plurality of second trenches between the adjacent second bars. The first lattice-shaped body and the second lattice-shaped body are stacked in a stack direction.