Layer Temperature Simulation for Faster Powder Bed Fusion Scans

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Solution Overview

Problem

Existing thermal simulation methods for powder-based additive manufacturing processes are computationally intensive and inefficient, particularly when simulating individual layers during production, due to the need for three-dimensional calculations.

Innovation Solution

A method is developed to simulate the temperature curve of a layer using a two-dimensional model that accounts for location-dependent specific heat capacity and thermal resistance, eliminating Z-dependency by incorporating parameter functions and source terms, allowing for faster and more accurate thermal simulations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If three-dimensional thermal simulation is used for powder-based additive manufacturing processes, then high accuracy is achieved, but computing time is excessive and efficiency is reduced

Engineering Contradiction:
Improvethermal simulation accuracyVSAvoidcomputing efficiency
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent transforms the three-dimensional thermal simulation problem into a two-dimensional cross-sectional model. By representing the layer and underlying structure in 2D with location-dependent specific heat capacity and thermal resistance, the computation complexity is dramatically reduced while maintaining essential thermal behavior accuracy, enabling real-time or near-real-time simulation during production

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces location-dependent material properties (specific heat capacity and thermal resistance) in the 2D cross-sectional model to account for variations in the underlying structure. This allows the simplified 2D model to capture local thermal characteristics that would otherwise require full 3D simulation, maintaining accuracy where it matters most while reducing overall computational burden

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If three-dimensional thermal simulation is performed for each layer during production, then accurate temperature control is achieved, but the process becomes too time-consuming for real-time application

Engineering Contradiction:
Improvetemperature control accuracyVSAvoidsimulation time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent reduces the computational dimension from 3D to 2D by creating cross-sectional models for thermal simulation. This dimensional reduction decreases the number of calculation nodes and elements required, enabling temperature simulation to be completed within the tight time constraints of production cycles while still providing accurate temperature control data for process optimization

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If full three-dimensional modeling including powder structure is simulated, then complete thermal behavior is captured, but device complexity and computational requirements increase significantly

Engineering Contradiction:
Improvethermal behavior accuracyVSAvoidmodel complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts only the essential thermal characteristics needed for process control by creating a 2D cross-sectional model that focuses on the layer and underlying structure. By omitting detailed 3D powder structure representation and using location-dependent material properties instead, the model captures the critical thermal behavior while significantly reducing complexity and computational requirements

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the modeling approach from detailed geometric representation to parameter-based representation using location-dependent specific heat capacity and thermal resistance. This parameter transformation allows the model to represent complex thermal behavior with simplified 2D geometry and variable material properties, reducing model complexity while maintaining reliability

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces computing time while maintaining high accuracy, enabling real-time or near-real-time thermal simulation of layers during production, thus improving the efficiency and quality of additive manufacturing processes.

Implementation Method 1

ascertaining the temperature curve by thermally simulating a scan of the layer with the exposure vectors using the model. The model represents the layer and a portion of the object below the layer in the form of a cross-section. The cross-section has the shape of the layer and takes into account a portion of the object lying below the layer in the form of a location-dependent specific heat capacity and a location-dependent thermal resistance.

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20250353256A1Ascertaining a temperature curve of a layer
Publication Date: 2025.11.20 SIEMENS AG
  • US20250353256A1 patent drawing
  • US20250353256A1 patent drawing
  • US20250353256A1 patent drawing

AI summary

In a computer-implemented method for ascertaining a temperature curve of a layer, which is a cross-section of an object, for selective solidification of the layer by a laser or electron beam for a powder-based additive manufacturing process, exposure vectors are provided for the layer. A model of the layer is provided, wherein the model represents the layer and a portion of the object lying below the layer as the cross-section of the object, and takes into account a portion of the object lying below the layer as a location-dependent specific heat capacity and a location-dependent thermal resistance. The temperature curve is ascertained by thermally simulating a scan of the layer with the exposure vectors using the model.