Layered Temporary Carrier Plate for Ultra-Thin Substrate Etching
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Solution Overview
Problem
Existing carrier plates, such as metal and copper-clad plates, are too thick, heavy, and costly, leading to equipment handling difficulties, high production costs, and yield reduction due to etching defects and equipment incompatibility with ultra-thin substrates.
Innovation Solution
A temporary carrier plate with a layered structure comprising a first and second carrier core layer and copper foil layers, each with varying thicknesses and dimensions, and etch barrier layers to prevent water vapor ingress and facilitate easy separation, ensuring rigidity and reducing etching risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal carrier plate with thickness of 0.2mm-0.3mm is used, then support strength is improved, but etching amount becomes excessive (0.25-0.35mm) causing cracks and erosion through line layer and copper pillar layer
Solution Approach 1:
The patent changes the thickness parameter of the carrier plate from conventional 0.2mm-0.3mm to a thinner range of 0.03mm-0.1mm, and adjusts the copper foil thickness to 5μm-20μm. This parameter optimization reduces the required etching amount to 0.05mm-0.15mm, preventing etching solution from cracking or eroding through the line layer and copper pillar layer while maintaining sufficient support strength during manufacturing processes.
Solution Approach 2:
The patent employs a composite structure consisting of a plastic carrier plate base material combined with a copper foil layer. This composite material design provides both the mechanical support strength needed during manufacturing and the electrical conductivity required for PCB functions, while the thin copper foil layer (5μm-20μm) minimizes etching requirements and associated defects.
2Strength
If a metal carrier plate with thickness of 0.2mm-0.3mm is used, then support strength is improved, but weight increases making manual handling and equipment transfer difficult
Solution Approach 1:
The patent reduces the carrier plate thickness from 0.2mm-0.3mm to 0.03mm-0.1mm and uses plastic base material instead of solid metal, dramatically reducing the weight of the carrier plate. This makes manual handling and equipment transfer much easier while the copper foil layer maintains the necessary structural support and electrical properties.
3Strength
If a copper-clad plate is used as temporary carrier plate, then support strength is improved, but cost increases and equipment compatibility decreases due to need for new equipment and supporting medicament
Solution Approach 1:
The patent uses a plastic carrier plate with a thin copper foil layer (5μm-20μm) instead of thick copper-clad plates. This approach maintains support strength during manufacturing while being compatible with existing PCB manufacturing equipment and processes, avoiding the need for new equipment or specialized supporting chemicals, thereby reducing overall manufacturing cost.
4Length of moving object
If carrier plate thickness is reduced to support ultra-thin substrates, then substrate thickness is reduced, but rigidity and resistance to plate bursting decrease
Solution Approach 1:
The patent uses a composite structure with a plastic carrier plate base and a copper foil layer. The plastic base provides flexibility and shock absorption, while the copper foil layer (5μm-20μm) provides structural rigidity and resistance to plate bursting. This composite approach enables support for ultra-thin substrates (0.06mm and below) while maintaining sufficient mechanical strength throughout the manufacturing process.
Solution Approach 2:
The patent applies copper foil selectively on the plastic carrier plate surface where electrical conductivity and structural reinforcement are needed, rather than using solid metal throughout. This localized application of copper provides the necessary rigidity and burst resistance at critical areas while keeping the overall carrier plate thin and flexible enough to support ultra-thin substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides sufficient rigidity for ultra-thin substrates, reduces the risk of plate bursting, and improves production yield and equipment compatibility while lowering manufacturing costs.
Implementation Method 1
the first copper foil layer includes physically press-fitted first outer-layer copper foil and first inner-layer copper foil, and the second copper foil layer includes physically press-fitted second outer-layer copper foil and second inner-layer copper foil
Implementation Method 2
an etch barrier layer is applied on an outer surface of the first copper foil layer and an outer surface of the second copper foil layer... the etch barrier layer prevents water vapor in a gap between the copper foil layers from penetrating inwardly through capillary action
Data Source
AI summary
A temporary carrier plate according to an embodiment of the present disclosure includes a first carrier core layer, a first copper foil layer on the first carrier core layer, a second carrier core layer on the first copper foil layer, and a second copper foil layer on the second carrier core layer, wherein the first copper foil layer includes physically press-fitted first outer-layer copper foil and first inner-layer copper foil, and the second copper foil layer includes physically press-fitted second outer-layer copper foil and second inner-layer copper foil.