Layered Connector Assembly for High-Speed Crosstalk Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing connector assemblies for chip modules and circuit boards suffer from densely arranged circuits, leading to interference issues due to high speed signal circuits being located in the same layer, which affects high frequency characteristics and signal transmission efficiency.
Innovation Solution
A connector assembly with an adapter board featuring signal circuit layers at different heights, where high speed signal terminals are separated from low speed signal terminals, reducing crosstalk interference and allowing for efficient high speed signal transmission without overloading the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high speed signal circuits are arranged in the same layer on the circuit board, then the circuit density is increased, but crosstalk interference occurs between signal transmissions
Solution Approach 1:
The patent transitions from planar circuit arrangement to three-dimensional stacked layers. High speed signal circuits are distributed across multiple vertical layers (first layer, second layer, third layer) instead of being confined to a single plane. This vertical separation in the Z-dimension effectively reduces crosstalk while maintaining high circuit density, as signals in different layers are physically isolated yet still achieve high-speed transmission.
2Device complexity
If circuits are arranged densely on the circuit board, then the connector functionality is integrated, but high speed transmission effect is affected
Solution Approach 1:
The circuit board is segmented into multiple functional layers with distinct purposes. High speed signal circuits are separated into different layers (first layer for initial high speed signals, second layer for additional high speed signals, third layer for low speed signals). This segmentation allows each layer to be optimized for its specific function, maintaining signal integrity while achieving integrated connector functionality.
Solution Approach 2:
A dedicated high speed connector is introduced as an intermediary component between the circuit board and external devices. This specialized connector handles high speed signal transmissions separately from the general-purpose electrical connector, providing a dedicated transmission path that maintains signal quality while integrating multiple connection functions through the layered circuit board structure.
3Ease of manufacture
If first high speed signal circuits and second high speed signal circuits are located in the same layer, then the layout is simplified, but signal transmission reliability deteriorates due to interference
Solution Approach 1:
The patent resolves the layout complexity by utilizing vertical layering instead of horizontal separation. First high speed signal circuits are placed in the first layer, second high speed signal circuits in the second layer, and low speed signal circuits in the third layer. This three-dimensional arrangement maintains manufacturing simplicity while achieving reliable signal transmission through physical separation in the vertical dimension.
Data Source
AI summary
A connector assembly includes multiple terminals. Each terminal includes a conductive portion. The terminals include first and second high speed signal terminals and a low speed signal terminal. The conductive portions of the first and second high speed signal terminals and the low speed signal terminal are correspondingly defined as first, second and third conductive portions. An adapter board is located above a circuit board to be conductively connected to a cable directly or indirectly. The adapter board includes first and second signal circuit layers located at different heights. The first signal circuit layer includes a first high speed signal circuit conductively connecting the first conductive portion and a conductive wire of the cable. The second signal circuit layer includes a second high speed signal circuit conductively connecting the second conductive portion and another conductive wire of the cable. The third conductive portion is conductively connected to the circuit board.