Layered Dielectric Package Structure for Lower CDM Capacitance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The high capacitance of package assemblies during the manufacturing of computing systems leads to electrostatic discharge issues, causing damage to integrated circuitry due to short-duration, high-amperage discharges, which increases yield loss and manufacturing costs.
Innovation Solution
Incorporating a dielectric material with a lower dielectric constant in conjunction with a mold compound of higher dielectric constant, strategically positioned around the die, to reduce the overall capacitance of the package and minimize the size of electrostatic discharge protection devices, thereby reducing peak CDM currents and associated damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mold compound with high dielectric constant is used to encapsulate the die, then the package provides good electrical isolation and structural support, but the package capacitance increases leading to higher CDM electrostatic discharge damage
Solution Approach 1:
The encapsulation structure is segmented into multiple dielectric layers with different dielectric constants. A first dielectric material with lower dielectric constant is positioned adjacent to the die, while a second dielectric material with higher dielectric constant is positioned away from the die. This segmentation allows the package to maintain electrical isolation while reducing overall capacitance and CDM damage.
Solution Approach 2:
Different regions of the encapsulation structure are assigned different dielectric properties. The region close to the die uses low dielectric constant material to minimize capacitance and ESD damage, while distant regions use high dielectric constant material for electrical isolation. This local quality differentiation optimizes both protection and isolation functions.
2Reliability
If ESD protection devices are added to the die, then damage from electrostatic discharge is mitigated, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent introduces an intermediary encapsulation structure consisting of layered dielectric materials between the die and the external environment. This intermediary structure reduces capacitance and mitigates ESD damage, providing protection without requiring additional ESD protection devices on the die itself, thereby avoiding increased device complexity.
3Object-affected harmful factors
If the package capacitance is reduced, then CDM current peak is lowered reducing ESD damage, but the electrical isolation performance may be compromised
Solution Approach 1:
The encapsulation is segmented into multiple dielectric layers with different dielectric constants positioned at different distances from the die. This segmentation enables the package to reduce overall capacitance (lowering CDM current peak) while maintaining electrical isolation through the combined effect of the layered structure, where each layer contributes differently to the overall electrical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size and power requirements of electrostatic discharge protection devices, improves high-speed interface performance, and decreases noise coupling, leading to enhanced package performance and reduced manufacturing costs.
Implementation Method 1
Incorporating a dielectric material with a lower dielectric constant in conjunction with a mold compound of higher dielectric constant, strategically positioned around the die, to reduce the overall capacitance of the package
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, techniques or processes for reducing the capacitance of a package that includes a die by at least partially surrounding the die within a mold compound and a dielectric material with different dielectric constants. Other embodiments may be described and/or claimed.