Layered Escalator Handrail Assembly Without Solvent Bonding
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Solution Overview
Problem
Existing handrails made of materials like SBR, CSM, EPDM, and CPE are bulky, requiring manual assembly with solvents and adhesives, leading to high costs, inefficiency, health risks, and susceptibility to errors due to manual labor.
Innovation Solution
A handrail design with a multi-layer ceiling structure comprising a top layer for environmental resistance and an adhesive layer for bonding, allowing machine assembly without solvents, using materials like CSM and SBR that are resistant and cost-effective, bonded via coextrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If handrails are made of resistant materials like SBR, CSM, EPDM, and CPE, then resistance to environmental influences is improved, but the materials become bulky and difficult to assemble manually
Solution Approach 1:
The ceiling structure is divided into multiple layers with distinct functions: a top layer (2) providing environmental resistance and an adhesive layer (3) enabling easy bonding to the substructure. This segmentation allows each layer to be optimized for its specific purpose, making the overall structure easier to manufacture while maintaining high resistance properties.
Solution Approach 2:
The patent uses composite material structure where different rubber materials are combined in layers. The top layer uses highly resistant materials (CSM, EPDM, or CPE) while the adhesive layer uses bondable materials (SBR or CR), creating a composite structure that achieves both resistance and ease of assembly.
2Strength
If manual assembly with solvents and adhesives is used, then bonding of ceiling structure to substructure is achieved, but manufacturing costs increase and production time increases
Solution Approach 1:
The patent extracts and eliminates the need for external solvents and adhesives by incorporating bonding functionality directly into the adhesive layer (3). This layer is designed to bond directly to the substructure without requiring additional chemical agents, thereby reducing manufacturing complexity and improving productivity.
Solution Approach 2:
The adhesive layer (3) is designed to perform the bonding function autonomously through its inherent adhesive properties. The layer bonds the ceiling structure to the substructure without requiring external assistance from solvents, adhesives, or complex manual assembly processes, enabling efficient machine assembly.
3Strength
If manual assembly is used, then bonding is achieved, but the risk of introducing dirt and loss of adhesion increases
Solution Approach 1:
The patent replaces manual mechanical assembly processes with a machine-based extrusion and bonding system. The adhesive layer (3) is extruded and bonded to the substructure in a controlled manufacturing process, eliminating the risk of contamination from manual handling and ensuring consistent adhesion quality.
4Strength
If solvents are used for assembly, then bonding is achieved, but occupational health and safety risks increase
Solution Approach 1:
The patent converts the potentially harmful use of solvents into a beneficial solvent-free bonding process. The adhesive layer (3) is designed to bond effectively without requiring solvent-based adhesion promoters, thereby eliminating occupational health risks while maintaining strong bonding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, solvent-free manufacturing with reduced costs, improved safety, and enhanced assembly accuracy, while maintaining high resistance to environmental influences.
Implementation Method 1
the adhesive layer can be used to bond the top layer (or the ceiling structure) and the substructure together
Implementation Method 2
The top layer and the adhesive layer can be connected to each other with a material bond by a manufacturing process (e.g. coextrusion process) of the ceiling structure
Implementation Method 3
The top layer and the adhesive layer can, for example, be connected to each other with a material bond by a manufacturing process (for example by extrusion, pressing, vulcanization, calendering, etc.)
Data Source
AI summary
A handrail mountable on a guide element for moving walkways, escalators or the like, includes a substructure arranged or configured to be arranged on the guide element, and a ceiling structure that includes at least one adhesive layer and a top layer, wherein the handrail has a substantially constant cross-section along a profile direction, wherein the materials of the top layer and the adhesive layer differ from one another, and wherein the ceiling structure with the adhesive layer is attached to the substructure.