Layered Insulating Structure for Moisture-Resistant Electronic Packaging
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Solution Overview
Problem
Conventional electronic devices with multi-layered insulating structures face challenges in product yield due to increased time in forming holes and cutting, as well as moisture sensitivity affecting the edge structure, leading to decreased reliability.
Innovation Solution
The design involves a second insulating layer in contact with the side-surfaces of a first insulating layer, enhancing the product yield by improving the protection against moisture and facilitating easier cutting processes through a structured manufacturing method that includes forming conductive and insulating layers step-by-step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of multi-layered insulating layers is increased, then the insulating performance is improved, but the time required to form holes and cut the insulating layers increases
Solution Approach 1:
The insulating layer is divided into a first insulating layer and a second insulating layer with different thicknesses. The first insulating layer has a greater thickness to provide superior insulating performance, while the second insulating layer has a smaller thickness to facilitate easier and faster hole formation and cutting operations, thereby resolving the contradiction between insulating performance and processing time
Solution Approach 2:
Different regions of the insulating structure are assigned different thicknesses based on their functional requirements. The first insulating layer is made thicker in regions where high insulating performance is critical, while the second insulating layer is made thinner in regions where ease of processing is prioritized, achieving both long-term reliability and manufacturing efficiency
2Reliability
If the thickness of multi-layered insulating layers is increased, then the insulating performance is improved, but the product yield decreases due to moisture sensitivity at cut edges
Solution Approach 1:
The insulating layer is segmented into two layers with different thicknesses. The thinner second insulating layer reduces moisture absorption at cut edges, thereby improving product yield, while the thicker first insulating layer maintains the required insulating performance, thus resolving the contradiction between insulating performance and product yield
Solution Approach 2:
The design accepts that thicker insulating layers provide better insulation but converts the potential harm of increased moisture sensitivity into a benefit by using a thinner second layer that is less susceptible to moisture, thereby improving yield while maintaining insulation through the first layer
3Productivity
If the thickness of insulating layers is reduced, then the cutting process is simplified and product yield is improved, but the insulating performance deteriorates
Solution Approach 1:
The insulating function is segmented between two layers: the first insulating layer provides the primary insulating performance with greater thickness, while the second insulating layer with smaller thickness facilitates simplified cutting and improves product yield, thus resolving the contradiction between insulating performance and productivity
Data Source
AI summary
An electronic device and a manufacturing thereof are disclosed. The electronic device includes a first conductive layer, a first insulating layer, a second insulating layer, a second conductive layer, a plurality of semiconductor elements and a covering layer. The first insulating layer is disposed on the first conductive layer. In a cross-sectional view of the electronic device, the first insulating layer has two side-surfaces which are opposite to each other. The second insulating layer is disposed on the first insulating layer and in contact with the two side-surfaces of the first insulating layer. The second conductive layer is disposed on the second insulating layer and electrically connected to the first conductive layer. The plurality of semiconductor elements are disposed on the second conductive layer and electrically connected to the second conductive layer. The covering layer is disposed on the plurality of semiconductor elements.