Layered Laser Scanning for Mixed-Material Semiconductor Processing

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Solution Overview

Problem

Existing laser processing technologies fail to achieve optimal processing quality when dealing with regions in a workpiece where materials differ in alignment along the scanning direction, such as in the manufacturing of QFN semiconductor devices, as they do not account for the specific conditions required for scanning across layers perpendicular to the processed surface.

Innovation Solution

A laser processing apparatus and method that control the emission and scanning of laser beams based on processing conditions tailored to each layer of material alignment, allowing for precise control of energy, frequency, speed, and scanning pitch to effectively remove resin and metal regions aligned along the scanning direction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If laser processing is performed on regions where different materials are aligned along the scanning direction using conventional methods, then processing can be completed, but processing quality deteriorates due to inability to account for layer-specific conditions

Engineering Contradiction:

Improveprocessing qualityVSAvoidadaptability to different material configurations

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The workpiece is divided into multiple layers along the scanning direction, with each layer assigned specific processing conditions. This segmentation allows independent optimization of laser parameters for each material layer, resolving the contradiction between maintaining processing quality and adapting to different material configurations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different processing conditions are applied to different layers based on their material properties and positions. Each layer receives localized processing parameters optimized for its specific characteristics, enabling high processing quality across diverse material configurations without requiring a completely different approach for each case.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If uniform laser processing conditions are applied across all layers, then device complexity is reduced, but manufacturing precision deteriorates due to inability to optimize for each layer

Engineering Contradiction:

Improvesurface precisionVSAvoidprocessing condition control

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system dynamically adjusts laser processing conditions based on the current layer being processed. The controller automatically modifies parameters such as laser power, scanning speed, and pulse frequency according to layer-specific requirements, achieving high surface precision while managing complexity through automated dynamic control rather than static uniform conditions.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

Laser processing parameters are changed according to the layer being processed. By varying key parameters like output power, frequency, and scanning speed based on material layer identification, the system achieves optimized surface precision for each layer while the controller manages the complexity of multiple parameter sets.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If laser output and frequency are kept constant across all layers, then operation simplicity is maintained, but processing quality worsens due to inability to optimize for different materials

Engineering Contradiction:

Improveprocessed surface qualityVSAvoidoperation simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

Processing conditions for each layer are predetermined and stored in the controller before actual processing begins. The system pre-configures optimal laser parameters, scanning speeds, and frequencies for each material layer based on their characteristics, allowing automated quality optimization during processing while maintaining operational simplicity through pre-programmed settings.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the attainment of desired processing quality by setting optimal laser processing conditions for each layer, preventing excessive cutting and ensuring surface precision and quality in regions with material differences, thereby improving the manufacturing process of semiconductor devices.

Implementation Method 1

removing the resin material in the groove portion by laser processing

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20250010401A1Laser processing apparatus, laser processing method, and method of manufacturing semiconductor device

Publication Date: 2025.01.09 TOWA

AI summary

A laser processing apparatus that removes a part of a workpiece by irradiating with laser beams, a region where portions in the workpiece different in material are provided as being aligned in a direction of scanning, and scanning the region with laser beams along the direction of scanning. A controller sets the part of the workpiece as a plurality of processing layers, and in scanning with laser beams, the controller controls an emitter and a scanner based on a processing condition for each of the plurality of processing layers. The processing condition for each of the plurality of processing layers is set based on positions of the portions in the region different in material.