Layered Lead Frame Pad Structure for Lighter Semiconductor Packages
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Solution Overview
Problem
Current semiconductor packages face challenges in reducing weight and production costs while maintaining excellent electrical conductivity and heat radiation performance, particularly due to the use of thick copper materials and the difficulty of bonding semiconductor chips to aluminum substrates.
Innovation Solution
A semiconductor package is designed with substrates bonded in a multi-layered vertical structure, where a thinner second substrate is bonded to a thicker first substrate, allowing for easy installation of semiconductor chips and improved electrical conductivity and heat radiation, using different or same metal materials with specific compositions and thickness ratios, and employing conductive adhesives and terminal structures for enhanced connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thick copper material is used to bond semiconductor chip for heat radiation, then heat radiation performance is improved, but weight and production cost increase
Solution Approach 1:
The substrate is divided into a multi-layered structure with a first substrate layer and a second substrate layer, where the second layer has lower thickness than the first layer. This segmentation allows heat radiation function to be distributed across layers rather than requiring a single thick copper layer, thereby reducing overall weight while maintaining thermal performance.
Solution Approach 2:
The invention uses composite substrate structure combining different material layers - the first substrate layer (potentially copper or copper alloy) and the second substrate layer (different material composition). This composite approach enables optimization of each layer's thickness and material properties to achieve both heat radiation performance and weight reduction.
2Reliability
If multi-layered vertical substrate structure is used for easy chip installation and improved conductivity, then electrical conductivity is improved, but device complexity increases
Solution Approach 1:
The substrate is segmented into a vertical multi-layered structure with a first substrate layer and a second substrate layer, where the second layer has lower thickness. This segmentation creates distinct functional zones that improve electrical conductivity by providing optimized current paths while maintaining a relatively simple overall structure that is easy to manufacture and assemble.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables easy chip installation, reduces package weight, lowers production costs, and maintains excellent electrical conductivity and heat radiation performance by optimizing substrate materials and structures.
Implementation Method 1
at least one semiconductor chip bonded onto the second substrate by using a conductive adhesive
Data Source
AI summary
The present invention provides a semiconductor package including a lead frame pad 110 including at least one first substrate 111 and at least one second substrate 112 structurally bonded to one surface of the first substrate 111, at least one semiconductor chip 120 bonded onto the second substrate 112 by using a conductive adhesive, a lead frame lead 130 including at least one first terminal 131 structurally or electrically connected to the lead frame pad 110 and at least one second terminal 132 spaced apart from the lead frame pad 110 by a regular distance, an electrical connection member 140 electrically connecting the semiconductor chip 120 with the second terminal 132, and a housing 150 partially or entirely covering the semiconductor chip 120 and the lead frame pad 110. Here, the lead frame lead 130 is exposed and extended to the outside of the housing 150 and the thickness of the second substrate 112 is less than the thickness of the first substrate 111. Accordingly, the semiconductor chip 120 may be easily installed and excellent electrical conductivity may be realized.