Layered Loop Heat Pipe Evaporator for Thin Mobile Cooling
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Solution Overview
Problem
Existing loop-type heat pipes are not thin enough for modern electronic devices, limiting their integration and efficiency.
Innovation Solution
A loop-type heat pipe design featuring a structure with multiple layers and porous bodies, including first and second metal layers with aligned bottomed holes and grooves, and a comb-tooth-shaped porous body to enhance fluid flow and reduce pressure loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional single-layer structure is used, then the manufacturing process is simpler, but the heat pipe cannot be sufficiently thinned
Solution Approach 1:
The heat pipe wall is segmented into multiple layers (first metal layer and second metal layer) with distinct functions. The first metal layer contains the porous body for fluid transport, while the second metal layer provides structural support and bonding surfaces, enabling thickness reduction without compromising functionality
Solution Approach 2:
The invention transitions from a conventional single-layer three-dimensional structure to a multi-layer planar structure. By distributing functions across different layers in the thickness direction, the overall heat pipe can be thinned while maintaining adequate flow channel volume and structural integrity
2Length of moving object
If the heat pipe is thinned, then it is more suitable for mobile devices, but the flow channel volume may be insufficient
Solution Approach 1:
The flow channel system is segmented into multiple components: bottomed holes for fluid storage, grooves for directional flow control, and fine pores for capillary transport. This segmentation allows efficient use of limited space within the thinned structure to maintain adequate flow channel volume
Solution Approach 2:
The flow channel structure employs a nested arrangement where bottomed holes are positioned within the first metal layer, grooves are formed on the bonding surface, and fine pores connect them across layers. This nested configuration maximizes flow channel volume within the reduced thickness
3Length of moving object
If multiple metal layers are used, then the heat pipe can be thinned, but the manufacturing precision requirements increase
Solution Approach 1:
The first metal layer is manufactured with the porous body structure (bottomed holes and grooves) pre-formed before bonding to the second metal layer. This preliminary formation of flow channels ensures precise positioning and alignment are maintained through the bonding process, reducing manufacturing precision requirements
Solution Approach 2:
The bonding surface is designed with local features (grooves and protrusions) that provide alignment guidance and mechanical interlocking. These localized quality enhancements at critical bonding regions ensure precise layer alignment without requiring high precision across the entire structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a thinner and more efficient heat pipe that effectively cools heat-generating components by enhancing fluid flow and reducing pressure loss, suitable for mobile electronic devices.
Implementation Method 1
a fine pore, wherein the first bottomed hole and the second bottomed hole partially communicate with each other through the fine pore
Implementation Method 2
an evaporator configured to vaporize a working fluid
Implementation Method 3
a heat pipe configured to transport heat by using a phase change of a working fluid
Implementation Method 4
a condenser configured to condense the working fluid
Implementation Method 5
a heat pipe configured to transport heat by using a phase change of a working fluid
Implementation Method 6
a heat pipe configured to transport heat by using a phase change of a working fluid
Implementation Method 7
a heat pipe configured to transport heat by using a phase change of a working fluid
Data Source
AI summary
An evaporator includes a first metal layer having a first inner surface and a first outer surface, a second metal layer having a second inner surface bonded to the first inner surface and a second outer surface, and a porous body provided between the first outer surface and the second outer surface. The porous body includes first bottomed holes provided in the first inner surface, second bottomed holes provided in the second inner surface, a fine pore, a first groove portion provided in the first inner surface, and a second groove portion provided in the second inner surface. The first groove portion and the second groove portion are provided not to overlap each other in a plan view. The first outer surface and the second outer surface serve as an outer surface of the evaporator.