Layered Loop-Type Heat Pipe for Thin Electronic Cooling
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Solution Overview
Problem
Existing loop-type heat pipes are not thin enough for modern electronic devices, limiting their integration and efficiency.
Innovation Solution
A loop-type heat pipe design featuring a stacked structure of metal layers with porous bodies and specific pore and groove configurations to enhance fluid flow and reduce thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional loop-type heat pipe structure is used, then heat transfer function is achieved, but the thickness is too large for modern electronic devices
Solution Approach 1:
The heat pipe wall is segmented into multiple layers including porous layers and non-porous layers, with each layer serving specific functions. The porous layers provide capillary channels while non-porous layers provide structural support, allowing thinning while maintaining heat transfer capability
Solution Approach 2:
Porous materials are used to create capillary channels within the heat pipe wall structure. The porous layers with controlled pore sizes enable effective working fluid transport through capillary action, reducing the need for thick walls while maintaining heat transfer function
Solution Approach 3:
The heat pipe employs composite structure combining porous and non-porous materials in alternating layers. This composite approach optimizes the balance between capillary fluid transport and structural integrity, enabling thinner design without compromising reliability
2Volume of moving object
If the heat pipe is thinned to reduce size, then integration into electronic devices is improved, but heat transfer efficiency may deteriorate
Solution Approach 1:
Different regions of the heat pipe wall have different properties - porous layers for fluid transport and non-porous layers for thermal conduction. This local differentiation optimizes heat transfer efficiency throughout the structure while maintaining compact volume
Solution Approach 2:
The heat pipe structure transitions from a single thick wall to a multi-layered configuration with alternating porous and non-porous layers. This dimensional restructuring increases surface area for heat transfer while reducing overall thickness, improving volume efficiency without sacrificing heat transfer performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a thinner profile while maintaining effective heat transfer capabilities, enhancing cooling performance in electronic devices.
Implementation Method 1
a porous body provided between the first outer surface and the second outer surface, and wherein the porous body comprises: a first bottomed hole provided in the first inner surface, a second bottomed hole provided in the second inner surface, a first fine pore, wherein the first bottomed hole and the second bottomed hole partially communicate with each other through the first fine pore
Implementation Method 2
a heat pipe configured to transport heat by using a phase change of a working fluid is suggested as a device configured to cool a heat-generating component of a semiconductor device
Implementation Method 3
an evaporator configured to vaporize a working fluid by heat of a heat-generating component
Implementation Method 4
a condenser configured to cool and condense the vaporized working fluid
Data Source
AI summary
An evaporator includes a first metal layer having a first inner surface and a first outer surface, a second metal layer having a second inner surface and a second outer surface, and a porous body provided between the first outer surface and the second outer surface. The porous body includes a first bottomed hole provided in the first inner surface, a second bottomed hole provided in the second inner surface, a first fine pore, wherein the first bottomed hole and the second bottomed hole partially communicate with each other through the first fine pore, a first groove portion provided in the first inner surface and configured to communicate with the first bottomed hole, and a second groove portion provided in the second inner surface and configured to communicate with the second bottomed hole. The first outer surface and the second outer surface serve as an outer surface of the evaporator.