Layered Metal Probe Structure for Stable 3D Microfabrication
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Solution Overview
Problem
Current manufacturing techniques for miniaturized and complex metal structures, such as testing probes, are difficult and expensive, lacking effective structural stability and planarization during the manufacturing process.
Innovation Solution
A method involving multiple layers of photoresist and metallic primary layers is used to create conductive segments within a metal structure, ensuring stability and planarization, with optional embedding in an elastomeric matrix for additional support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If current manufacturing techniques are used for miniaturized and complex metal structures, then the structures can be produced, but the manufacturing process becomes difficult and expensive with poor structural stability
Solution Approach 1:
The manufacturing process is divided into multiple sequential steps involving alternating deposition of photoresist layers and metallic primary layers. Each layer is processed independently through patterning and etching, allowing complex 3D metal structures to be built incrementally with high precision while maintaining ease of manufacture through standardized repeated operations.
Solution Approach 2:
The invention transitions from traditional planar manufacturing to a multi-layer vertical architecture. By depositing and processing multiple alternating layers of photoresist and metal in the vertical dimension, the method achieves complex 3D metal structures with internal vias and interconnections, thereby improving manufacturing precision for miniaturized components.
2Length of moving object
If miniaturization is applied to testing probes, then the probes become more compact, but the manufacturing difficulty and cost increase significantly
Solution Approach 1:
The probe structure is segmented into multiple thin alternating layers of photoresist and metal, each with thickness controlled at micrometer or sub-micrometer scales. This layered segmentation enables miniaturization while using standardized deposition and patterning processes that remain manufacturable despite the reduced dimensions.
Solution Approach 2:
The invention achieves miniaturization by precisely controlling the thickness parameters of each photoresist and metal layer, as well as the dimensions of conductive segments and vias. By adjusting these geometric parameters during the alternating deposition process, compact probe structures are obtained while maintaining manufacturing feasibility through controlled parameter variations.
3Adaptability or versatility
If complex configurations are adopted for testing probes, then specific technological advantages are obtained, but the manufacturing process becomes more difficult and expensive
Solution Approach 1:
Complex probe configurations including articulated shapes, internal vias, and interconnections are achieved by segmenting the structure into multiple alternating photoresist and metal layers. Each layer can be independently patterned to create the desired complex geometry, and the alternating nature allows for internal features like vias to be formed without requiring through-hole drilling or complex assembly.
Solution Approach 2:
The invention resolves manufacturing complexity by moving the creation of complex features into the vertical dimension. Instead of forming complex 3D structures in a single planar step, the alternating layer deposition process builds complexity vertically, with each layer contributing specific geometric features that combine to form the final complex configuration.
4Stability of the object's composition
If multiple alternating layers of photoresist and metallic primary layers are deposited, then structural stability and planarization are improved, but the number of manufacturing steps increases
Solution Approach 1:
The structure is divided into multiple alternating photoresist and metal layers, each contributing to overall structural stability. The photoresist layers provide mechanical support and planarization between metal layers, while the metal layers provide structural integrity and electrical conductivity. This segmentation into functional layers improves structural stability without requiring excessive process complexity.
Solution Approach 2:
The photoresist layers act as intermediary elements between the metal layers, providing mechanical support, planarization, and structural stability during and after the deposition process. These intermediary photoresist layers simplify the overall manufacturing process by enabling self-aligned patterning and reducing the need for additional support structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for cost-effective, structurally stable, and functionally reliable metal structures with complex configurations, enabling efficient electrical connections and simplified manufacturing processes.
Implementation Method 1
etching said first photoresist layer so as to form at least one first through opening in said first photoresist layer
Implementation Method 2
filling said at least one first through opening with a conductive material so as to form at least one first conductive segment
Implementation Method 3
depositing a first metallic primary layer on said first photoresist layer
Data Source
AI summary
A method for manufacturing a metal structure designed to put a plurality of electronic devices in electric contact, the method including the steps of: arranging a planar lower support; depositing a first photoresist layer on the lower support; etching the first photoresist layer so as to form at least one first through opening in the first photoresist layer; filling the at least one first through opening with a conductive material so as to form at least one first conductive segment, which develops along a growth direction; depositing a first metallic primary layer on the first photoresist layer; repeating the previous steps to form other conductive segments in line with the first one to define the metal structure; and a step of removing the photoresist layers and the metallic primary layers so as to release the metal structure.