Layered Micro LED Optical Interconnect for Extraction and Reliability

The micro LED structure is divided into multiple functional layers including a semiconductor light-emitting structure with first and second conductive semiconductor layers, an active layer, electrode layers, passivation layers, reflective structures, and microlenses. This segmentation allows each layer to be optimized for its specific function, thereby improving overall light extraction efficiency while managing complexity through modular design

The patent introduces vertical stacking of multiple layers in the depth dimension, transforming a planar LED structure into a three-dimensional layered architecture. This dimensional change enables improved light extraction by controlling light propagation paths through multiple interfaces and layers, addressing the light extraction efficiency challenge while organizing complexity vertically

The patent specifies precise structural configurations and material compositions in advance during the design phase, including the stacking sequence of layers, their thicknesses, and material properties. These preliminary specifications guide the manufacturing process to achieve consistent performance and high reliability while managing precision requirements through clear design criteria

The patent optimizes various parameters including layer thicknesses, material compositions, doping concentrations, and structural dimensions to achieve the desired balance between reliability and manufacturability. By carefully selecting and controlling these parameters, the design achieves consistent performance while considering practical manufacturing capabilities