Layered Microprobe Structure for Insertion Stress Protection

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Solution Overview

Problem

Micro-sensing systems face challenges in withstanding insertion forces and torques while minimizing pain and preventing brittle material fracture, particularly in chip-based sensor systems using microneedles or neural probes.

Innovation Solution

A layered microprobe design incorporating a sensing unit, a ductile layer, and a deformable layer, where the ductile layer absorbs external forces and the deformable layer insulates and deforms under stress, combined with an encapsulant to protect the structure from the environment and minimize debris.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a chip-based sensor system uses microneedles or neural probes, then sensing capability is improved, but the system becomes vulnerable to brittle material fracture under insertion forces and torques

Engineering Contradiction:

Improvesensor system reliabilityVSAvoidresistance to insertion forces and torques

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The microprobe is divided into distinct functional segments: a brittle sensing unit for detection, a deformable intermediate layer for stress absorption, and a ductile support structure for mechanical strength. This segmentation allows each component to be optimized for its specific function while protecting the vulnerable sensing unit from mechanical failure during insertion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The microprobe employs a composite structure combining materials with different mechanical properties: brittle materials (e.g., silicon, glass) for the sensing unit provide sensing capability, while ductile materials (e.g., metals, polymers) for the support structure provide mechanical strength and flexibility. The deformable layer acts as a buffer between these material types, enabling the composite structure to withstand insertion forces without fracturing the brittle sensing components.

Inventive Principle:

Principle #40Composite materials

2Measurement precision

If the sensing unit is made from brittle material for precise sensing, then measurement precision is improved, but the material fractures under stress during insertion and use

Engineering Contradiction:

Improvesensing precisionVSAvoidresistance to fracture under stress

Core Design Contradiction:

Measurement precisionVSStrength

Solution Approach 1:

A deformable intermediate layer is introduced between the brittle sensing unit and the ductile support structure. This intermediary layer absorbs and distributes mechanical stresses, preventing direct stress transmission to the brittle sensing unit. The deformable layer deforms under stress while protecting the sensing unit from fracture, thereby maintaining both measurement precision and structural integrity during insertion and use.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If the microprobe structure is exposed to the surrounding environment, then sensor functionality is maintained, but debris is generated from material degradation and fracture

Engineering Contradiction:

Improvesensor functionalityVSAvoiddebris generation

Core Design Contradiction:

Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The microprobe is encapsulated with a flexible protective coating or shell that isolates the internal components from the surrounding environment. This encapsulation prevents material degradation and fracture-induced debris generation while allowing the sensor to maintain its functionality. The flexible nature of the encapsulant ensures it can accommodate the deformable layer's movements without compromising sensor operation.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The layered microprobe design enhances mechanical robustness, allowing it to withstand insertion forces and torques, reduces pain, and ensures a 'zero debris' process by shielding the brittle sensing unit, thus maintaining structural integrity and safety.

Implementation Method 1

the deformable layer is configured to deform under stress

Methodology Applied

Scientific EffectDeformation: Deformation

Implementation Method 2

the deformable layer is configured to deform under stress

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 3

the at least one encapsulant is configured to isolate the layered structure from a surrounding environment

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS12502133B2Sensing system including layered microprobe

Publication Date: 2025.12.23 QULAB MEDICAL LTD

AI summary

A sensing system includes a microprobe, the microprobe including: a layered structure including: a sensing unit comprising a sensor including a working electrode, wherein the sensing unit has a first perimeter when viewed along a layering direction, includes a first material having a first toughness, and including a first side and a second side; a deformable layer configured to deform under stress and positioned on the first side of the sensing unit; a ductile layer positioned on the deformable layer opposite the sensing unit and having a second perimeter when viewed along the layering direction, the first perimeter being within the second perimeter, the ductile layer including a second material having a second toughness greater than the first toughness; a sensor-interface layer positioned on the second side of the sensing unit; and an encapsulant partially encapsulating the layered structure and mechanically isolating the layered structure from a surrounding environment.