Layered Electronic Module Assembly to Prevent Lamination Microcracks
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Solution Overview
Problem
Existing layered electronic devices experience premature aging and structural weakness due to stress-induced microcracks around integrated electronic modules, particularly under mechanical stress, and current manufacturing methods are complex and costly.
Innovation Solution
A layered electronic device design featuring a first thermoplastic polymer layer with a cavity and an adhesive second layer with higher adhesion, where the adhesive layer maintains the electronic module's position during pressing, distributing stresses uniformly and preventing microcrack formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an electronic module is integrated within a stack of layers of materials, then the device achieves functional integration and tamper resistance, but stresses are generated between the module and layers creating weakness areas that lead to microcracks and premature aging
Solution Approach 1:
A specific layer is introduced between the electronic module and the surrounding layers of materials. This intermediary layer has mechanical properties that are intermediate between those of the electronic module and the polymer layers, thereby reducing stress concentration and preventing microcrack formation at the interface while maintaining functional integration
2Strength
If the layers of materials are hot-pressed to merge into a one-piece card body, then the integrity and tamper resistance are improved, but the mechanical stresses during pressing create weakness areas and microcracks
Solution Approach 1:
The specific layer acts as a stress buffer during the hot-pressing process, absorbing and distributing mechanical stresses uniformly across the interface between the electronic module and surrounding layers, thereby maintaining integrity while preventing stress-induced microcracks
Solution Approach 2:
The specific layer is designed with controlled mechanical and thermal parameters including elasticity modulus, thermal expansion coefficient, and melting temperature that allow it to deform appropriately during pressing to accommodate dimensional changes without creating stress concentrations
3Reliability
If a protective material is used to surround the electronic module, then the resistance to microcracks is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
The specific layer is integrated into the existing lamination process and combines multiple functions: it serves as both a stress buffer to prevent microcracks and as part of the structural card body. This merging of functions avoids additional manufacturing steps while achieving improved reliability
Solution Approach 2:
By carefully selecting the mechanical and thermal parameters of the specific layer to fall within certain ranges, the material can be processed using standard lamination equipment and procedures without requiring specialized manufacturing processes, thereby controlling complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances mechanical strength, reduces manufacturing complexity, and lowers costs by minimizing stress-induced microcracks and maintaining module immobility during the lamination process.
Implementation Method 1
an adhesive second layer of a second material having a higher adhesion than that of the first material, the adhesive second layer being at least partially in contact with the first layer and with the electronic module
Implementation Method 2
the used materials are thermoplastic polymers which deform, it is also said that they creep, under the action of pressing, and more particularly hot-pressing
Implementation Method 3
a flexible, elastic and temperature-resistant coating material, having a coefficient of thermal expansion higher than or equal to that of the substrate layer
Data Source
AI summary
A layered electronic device having: a first layer of a first thermoplastic polymer material, the first layer including a through cavity; an electronic module inserted at least partially within the through cavity of the first layer; and an adhesive second layer of a second material having an adherence higher than that of the first material, the adhesive second layer being at least partially in contact with the first layer and with the electronic module; the first layer being at least partially in contact with the electronic module.