Layered Optical Assembly for Ultra-Small Endoscope Manufacturing
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Solution Overview
Problem
Existing endoscope technologies face challenges in manufacturing ultra-small-diameter endoscopes with diameters smaller than 1.5 mm, which are required for minimally invasive procedures, as they often result in defective products due to the inclusion of defective image capturing devices and are difficult to produce in small quantities with varying specifications.
Innovation Solution
The development of an image capturing module with a layered optical assembly, where the image capturing portion has a photodetection surface and a reverse surface with external electrodes, bonded to a layered optical portion with a larger rear surface, allowing for the fabrication of ultra-small endoscopes with a high aspect ratio, enabling easy manufacturing and high yield production by using only non-defective image capturing devices and employing a chip-on-wafer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional endoscope manufacturing methods are used, then endoscopes can be produced, but they cannot achieve ultra-small diameter (smaller than 1.5 mm) required for minimally invasive procedures
Solution Approach 1:
The endoscope is divided into modular components including a distal end portion with image capturing module, a bendable portion, and a proximal end portion. This segmentation allows independent optimization of each module, enabling ultra-small distal end diameter while maintaining overall functionality and reliability through modular assembly.
Solution Approach 2:
The image capturing module is nested within the distal end portion, with the lens array and image sensor integrated in a compact configuration. The bendable portion with artificial muscles is nested within the proximal end portion, allowing the ultra-small distal end to achieve flexibility without increasing overall diameter.
2Adaptability or versatility
If conventional manufacturing methods are used, then endoscopes can be produced, but they are difficult to manufacture in small quantities with varying specifications
Solution Approach 1:
The bendable portion uses artificial muscles as a universal actuation mechanism that can be controlled through multiple channels (first control signal for bending direction, second control signal for bending degree). This universal design allows the same structural component to adapt to different endoscope specifications and applications.
Solution Approach 2:
The endoscope incorporates dynamically controllable artificial muscles in the bendable portion, allowing the bending characteristics to be adjusted in real-time through control signals. This dynamic capability enables a single design to serve multiple specifications and applications.
3Length of moving object
If the image capturing module uses a compact design, then ultra-small diameter is achieved, but the manufacturing process becomes more difficult
Solution Approach 1:
The image capturing module is segmented into a lens array portion and an image sensor portion that can be manufactured separately and then integrated. This segmentation allows each component to be optimized for manufacturing while achieving compact overall dimensions when assembled.
Solution Approach 2:
A support structure acts as an intermediary component that holds the lens array and image sensor in precise relative positions. This mediator enables compact integration while maintaining manufacturing feasibility through standardized mounting interfaces.
Data Source
AI summary
An image capturing module is used in an endoscope. The image capturing module comprises an image capturing portion having opposed surfaces defined by respective photodetection and reverse surfaces. The reverse surface includes external electrodes disposed thereon. A layered optical portion having a front surface to which light is applied and a rear surface that is opposite of the front surface. The layered optical portion having a plurality of optical members layered together. A layered device having a first principal surface with joint electrodes disposed thereon. A second principal surface opposes the first principal surface. The first principal surface is bonded to the reverse surface. The joint electrodes are joined to the external electrodes. The layered device includes a plurality of semiconductor devices layered together in which the first principal surface is larger in area than the photodetection surface and smaller in area than the rear surface.