Layered Semiconductor Package Structure for Warpage and Die Shift
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Solution Overview
Problem
Semiconductor device packages face issues such as warpage and die-shifting due to encapsulation, leading to reliability problems.
Innovation Solution
A semiconductor device package design featuring a first encapsulant surrounding the device and a second encapsulant covering both, with a redistribution layer extending through the second encapsulant and electrically connected to the device, along with a tapered sidewall to guide proper placement and a hard encapsulant to mitigate warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor device is attached to a carrier and molded by an encapsulant, then the device is protected and packaged, but warpage and die-shifting phenomena occur causing reliability issues
Solution Approach 1:
The encapsulation structure is divided into two separate encapsulants: a first encapsulant that surrounds the semiconductor device and a second encapsulant that covers both the device and the first encapsulant. This segmentation allows each encapsulant to perform specific functions - the first provides structural support and the second provides protection - thereby reducing warpage and die-shifting while maintaining manufacturing precision
Solution Approach 2:
The first encapsulant is nested within the second encapsulant, creating a layered encapsulation structure. The semiconductor device is disposed in a cavity formed by the first encapsulant, and the second encapsulant is formed over this cavity to cover both the device and the first encapsulant. This nested arrangement provides enhanced structural stability and reduces warpage phenomena
2Object-affected harmful factors
If an encapsulant is used to mold the semiconductor device, then the device is protected, but warpage phenomenon occurs
Solution Approach 1:
The encapsulation is segmented into two distinct encapsulants with different functions. The first encapsulant provides structural support and defines a cavity for the device, while the second encapsulant provides protective coverage. This segmentation allows optimization of each encapsulant's properties to maintain package flatness while providing protection
Solution Approach 2:
Different regions of the encapsulation structure have different properties - the first encapsulant has structural characteristics suitable for supporting the device, while the second encapsulant has protective characteristics. This local differentiation of material properties helps prevent warpage while maintaining overall protection
3Manufacturing precision
If a tapered sidewall is added to guide proper placement, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The first encapsulant features a tapered sidewall that curves inward toward the cavity, creating a funnel-like guide structure. This curved geometry naturally guides the semiconductor device into proper alignment during placement without requiring additional alignment mechanisms, thereby improving placement precision while adding minimal structural complexity
Data Source
AI summary
A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.