Layered Polishing Pad Structure for Consistent Semiconductor CMP
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Solution Overview
Problem
Existing polishing pads in semiconductor manufacturing lack the ability to provide diverse polishing properties for various objects and materials, leading to inconsistent polishing results and reduced long-term performance, while also posing environmental concerns due to non-recyclable materials.
Innovation Solution
A polishing pad with a structured design comprising a polishing variable layer and a polishing constant layer, where the Shore D hardness ratio is between 0.50 to 1.50, and the polishing variable layer includes grooves, allowing for adjustable surface roughness and depth changes, enhancing polishing performance and recyclability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional polishing pad with uniform structure is used, then the manufacturing process is simple, but the polishing performance is inconsistent for different materials and the long-term performance deteriorates
Solution Approach 1:
The polishing pad is divided into multiple functional layers: a polishing variable layer with varying Shore D hardness (0.50 to 1.50 ratio) containing grooves for material removal, and a polishing constant layer for structural support. This segmentation allows each layer to perform specific functions, improving polishing consistency across different materials and extending pad life through controlled wear patterns.
Solution Approach 2:
The polishing variable layer incorporates localized grooves and varying hardness regions to provide different polishing characteristics in different areas. This local quality variation enables the pad to adapt to different material types and polishing stages, maintaining consistent performance throughout the pad's service life while accommodating diverse semiconductor materials.
2Reliability
If a polishing pad with fixed structure is used, then the initial polishing rate is high, but the long-term polishing performance degrades
Solution Approach 1:
The polishing variable layer is designed with grooves that enable dynamic adaptation during the polishing process. As the pad wears, the groove structure evolves to maintain optimal polishing characteristics, ensuring consistent performance over extended periods. The varying Shore D hardness ratio (0.50 to 1.50) allows different regions to wear at controlled rates, preserving the polishing rate while extending service life.
Solution Approach 2:
The polishing pad incorporates parameters that change during operation, including groove depth, surface roughness, and effective polishing area. These parameter changes are controlled through the specific groove geometry and hardness distribution, allowing the pad to maintain reliable polishing performance while adapting to material removal patterns and extending productivity.
3Ease of manufacture
If non-recyclable materials are used in the polishing pad, then the manufacturing cost is low, but environmental sustainability is compromised
Solution Approach 1:
The polishing pad is designed with a modular layered structure where the polishing variable layer can be separated and recycled. The specific groove geometry and material composition enable controlled disposal of worn polishing surfaces while recovering the constant layer for reuse or regeneration, reducing environmental impact while maintaining manufacturing efficiency through standardized production processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structured polishing pad ensures optimal polishing characteristics for diverse semiconductor materials, maintains performance over time, and promotes environmental sustainability through recyclable components.
Implementation Method 1
a polishing pad which includes a polishing layer, the polishing layer including a polishing variable layer having a polishing surface, and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface, and wherein the ratio of shore D hardness of the polishing variable layer and the polishing constant layer is from 0.50 to 1.50
Implementation Method 2
The CMP process may be performed on a predetermined polished surface of a polishing object for the purposes of the planarization of the polished surface, removal of aggregated materials therefrom
Data Source
AI summary
The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, the polishing pad includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface, and wherein the polishing constant layer includes a cured product of a composition having thermosetting polyurethane particles and a binder.