Layered Polyimide Substrate for Flexible Display Heat Resistance
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Solution Overview
Problem
Plastic substrates used in flexible displays suffer from inferior heat resistance, thermal conductivity, and electrical insulation compared to glass substrates, leading to issues like deformation and afterimages during high-temperature manufacturing processes.
Innovation Solution
A substrate for flexible displays comprising a first polyimide resin layer with a Td 1% of 570° C. or more and a yellowness index of 25 to 60, a second polyimide resin layer with a yellowness index of less than 25, and inorganic material layers of specific thicknesses to enhance heat resistance and electrical insulation, minimizing deformation and afterimages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a plastic substrate is used in flexible displays, then the display becomes lightweight and flexible, but heat resistance and electrical insulation deteriorate
Solution Approach 1:
The patent uses a composite structure consisting of a plastic substrate layer and a polyimide resin layer. The plastic substrate provides flexibility and light weight, while the polyimide resin layer with Td 1% of 570°C or more provides high heat resistance. This composite material approach allows the flexible display to maintain both flexibility and thermal stability during manufacturing processes.
2Adaptability or versatility
If a plastic substrate is used in flexible displays, then the display becomes flexible, but electrical insulation property deteriorates
Solution Approach 1:
The patent combines a plastic substrate with a polyimide resin layer to create a composite structure. The plastic substrate ensures flexibility and bendability, while the polyimide resin layer provides superior electrical insulation properties. This composite approach allows the flexible display to maintain both adaptability and reliable electrical insulation.
3Device complexity
If a single polyimide resin layer is used, then the structure is simple, but heat resistance and resistance characteristics cannot be optimized simultaneously
Solution Approach 1:
The patent divides the polyimide resin structure into two distinct layers: a first polyimide resin layer with Td 1% of 570°C or more and yellowness index of 25-60 (providing heat resistance), and a second polyimide resin layer with yellowness index of less than 25 (providing resistance characteristics). This segmentation allows each layer to be optimized for its specific function, achieving both heat resistance and high resistance characteristics simultaneously.
Solution Approach 2:
The patent applies local quality by giving different properties to different layers. The first polyimide resin layer is designed with specific thermal properties (Td 1% ≥ 570°C) for heat resistance, while the second polyimide resin layer is designed with specific optical properties (yellowness index < 25) for resistance characteristics. Each layer has localized properties optimized for its specific role in the composite structure.
Data Source
AI summary
The present disclosure relates to a substrate for a display device or a flexible display device that realizes low dielectric properties and excellent heat resistance, and a display device or a flexible display device using the same.