Layered Power Electronics Packaging Without Thick Copper PCBs
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Solution Overview
Problem
Conventional high-power electronics devices face limitations in carrying high current due to heat generation and the need for expensive thick copper PCBs, which are costly and challenging to manufacture, especially for lower volume applications.
Innovation Solution
A high-power electronics device is manufactured using a layered structure comprising a molding compound, a printed circuit board, electrically conductive contacts, and electronic components, with thick conductive stampings that eliminate the need for thick copper PCBs, allowing for efficient heat management and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If thick copper PCBs are used to carry high current, then current carrying capacity is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent divides the current carrying function into separate components: thin PCB traces for signal routing and external heavy gauge copper bus bars for high current carrying. This segmentation allows each component to be optimized independently, avoiding the need for expensive thick copper PCBs while maintaining high current capacity through the bus bar attachments.
Solution Approach 2:
The patent transitions from planar current carrying (PCB traces) to three-dimensional current paths by attaching heavy gauge copper bus bars that extend vertically from the PCB surface. This dimensional change allows high current capacity without increasing PCB copper thickness, solving the contradiction between current carrying ability and manufacturing complexity.
2Quantity of substance
If multiple PCB layers with thick copper are used to carry high current, then current carrying capacity is improved, but heat removal becomes difficult
Solution Approach 1:
The patent extracts the heat generation function from the PCB structure by moving high current paths to external bus bars. This separation allows the PCB to focus on signal routing and control functions with minimal heat generation, while the bus bars handle high current and can be directly attached to heat sinks for efficient thermal management.
Solution Approach 2:
The patent introduces external bus bars as intermediary components between the PCB and heat sinks. These bus bars serve as thermal conduits that can be directly attached to heat sinking structures, providing an efficient heat removal path that is not available with internal PCB traces.
3Ease of manufacture
If conventional PCB packaging methods are used, then manufacturing simplicity is maintained, but current carrying capacity is limited
Solution Approach 1:
The patent merges conventional PCB manufacturing with external bus bar attachments. The PCB is manufactured using standard processes, then heavy gauge copper bus bars are attached to specific locations. This combination maintains the simplicity of conventional PCB manufacturing while adding high current carrying capability through the external bus bars.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of smaller, lighter, and more reliable high-power electronics devices that can carry high currents without the expense and complexity of thick copper PCBs, making them suitable for a wider range of applications.
Implementation Method 1
a first layer of molding compound, a second layer on top of the first layer comprising a printed circuit board
Implementation Method 2
a third layer on top of the second layer formed of electrically conductive contacts
Implementation Method 3
One of the challenges associated with transferring high power (high current) is the heat generated in the current path (I2×R). The key to minimizing the heat generated in the current path is to reduce the resistance in the system.
Data Source
AI summary
A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.