Layered Resonator Q Value Enhancement via Interdigital Coupling
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Solution Overview
Problem
Conventional layered bandpass filters face challenges in reducing inductive coupling between resonators while maintaining size and thickness reductions, leading to broad passband widths and decreased resonator Q values.
Innovation Solution
The design includes a layered substrate with resonators formed by alternately arranged conductor layers of different types, where all resonator-forming conductor layers of a specific type are directly connected to input/output terminals, increasing the Q value by interdigital-coupling and capacitive coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
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If the distance between adjacent resonators is reduced to achieve size and thickness reductions, then the filter size and thickness are reduced, but the inductive coupling between adjacent resonators becomes too strong, causing the passband width to become too broad
Solution Approach 1:
The patent transitions from planar resonator arrangements to a three-dimensional layered structure where resonators are stacked vertically across multiple substrate layers. This dimensional change allows resonators to be positioned closer in the horizontal plane (reducing filter footprint) while maintaining adequate separation in the vertical direction through alternating conductor layer arrangements, thereby reducing inductive coupling strength while preserving compact size.
Solution Approach 2:
The resonator structure is segmented into multiple conductor layers (first and second types) stacked alternately across different substrate layers. Each conductor layer forms part of the resonator structure, with capacitor-forming electrodes positioned between adjacent conductor layers. This segmentation allows independent optimization of coupling characteristics and resonator Q values while maintaining compact overall dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the Q value of resonators connected to terminals, allowing for improved filter characteristics and reduced inductive coupling, effectively addressing the limitations of conventional designs.
Implementation Method 1
The resonator-forming conductor layers of the two types alternately arranged in the stacking direction are interdigital-coupled to each other, thereby constituting a resonator including an inductor and a capacitor
Implementation Method 2
a capacitor-forming electrode disposed between the adjacent resonators and having a first end adjacent to the inductor-forming portion of the first resonator and a second end adjacent to the inductor-forming portion of the second resonator
Data Source
AI summary
An electronic component includes first and second resonators provided within a layered substrate including stacked dielectric layers. The first resonator includes resonator-forming conductor layers of a first type and a second type. The resonator-forming conductor layers of the first type and the second type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An input terminal is connected to all of the resonator-forming conductor layers of the first type. The second resonator includes resonator-forming conductor layers of a third type and a fourth type. The resonator-forming conductor layers of the third type and the fourth type are reversed in relative positions of the short-circuited end and the open-circuited end, and are alternately arranged in the stacking direction of the dielectric layers. An output terminal is connected to all of the resonator-forming conductor layers of the third type.